A chip bonding device and bonding method
A chip bonding and chip technology, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problem of low chip bonding yield and achieve the effect of improving yield
Active Publication Date: 2019-07-23
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
[0003] The invention provides a chip bonding device and a bonding method to solve the problem of low yield of chip bonding in the prior art
Method used
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[0032] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be noted that all the drawings of the present invention are in simplified form and use inaccurate scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.
[0033] Chip bonding device provided by the present invention, such as Figure 1 to Figure 3 shown, including:
[0034] A chip supply unit 10 is used to separate the chip 60 from the wafer and provide the chip 60 to be bonded;
[0035] The substrate supply unit 20 is used to provide a substrate and is arranged opposite to the chip supply unit 10. In this embodiment, the substrate supply unit 20 is placed upside down above the chip supply unit 10;
[0036] The first pick-up assembly 30, arranged between...
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Provided are a chip bonding apparatus and bonding method. The apparatus comprises: a chip supply unit (10); a substrate supply unit (20); a first pick-up assembly (30) arranged between the chip supply unit (10) and the substrate supply unit (20), comprising a first rotating component and a first pick-up head arranged on the first rotating component; a second pick-up assembly (40) comprising a second rotating component and a second pick-up head arranged on the second rotating component, wherein the first pick-up assembly (30) picks up a chip (60) from the chip supply unit (10) or the second pick-up assembly (40), and delivers the chip (60) onto a substrate of the substrate supply unit (20) to complete the bonding; and a vision unit (50) for realizing the alignment of the chip (60) and the substrate on the first pick-up assembly (30), wherein the chip supply unit (10), the substrate supply unit (20), the second pick-up assembly (40) and the vision unit (50) are respectively located on four work positions of the first pick-up head. The chip (60) is transported through rotation, improving the productivity of chip (60) bonding; and the chip (60) is reversed by utilizing the second pick-up assembly (40), which is compatible with two ways of bonding, i.e. a mark face of the chip (60) facing upwards and downwards.
Description
technical field [0001] The invention relates to the field of chip bonding, in particular to a chip bonding device and a bonding method. Background technique [0002] Die bonding is a form of interconnection formed by connecting a chip to a carrier. The bonded chip is generally placed on the separation table with the marked side facing up, and the chip is bonded to the bonding table by the chip transfer hand. The current chip bonding device needs to pick up the chip from the separation table, and then reach the bonding table after long-distance linear transmission, and bond the chip to the bonding table, which greatly affects the bonding yield; in addition, the chip and bond When the substrate on the bonding platform is bonded, there are requirements for the direction of the marking surface on the chip. Some require the marking surface to be bonded downward, and some require the marking surface to be bonded upward. The corresponding bonding device needs to be replaced to mee...
Claims
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IPC IPC(8): H01L21/67H01L21/60
CPCH01L21/67144H01L24/01H01L2221/67H01L21/681H01L24/75H01L24/81H01L2224/7565H01L2224/75745H01L2224/75753H01L2224/75822H01L2224/75842H01L2224/8113H01L21/52H01L21/67121H01L21/67259H01L21/67282H01L21/67712H01L21/67721
Inventor 王天明姜晓玉夏海陈飞彪
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD