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Monolithic integrated semiconductor chip for chopper circuit and preparation method thereof

A chopper circuit and semiconductor technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as large chopper circuit size, reduced reliability, and large footprint of core power devices

Active Publication Date: 2020-06-09
HUNAN UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Since the main control switching device and the synchronous rectification device as the core power device of the chopper circuit in the existing chopper circuit are two independent devices, the core power device occupies a large volume, resulting in a large volume of the chopper circuit; and , the external wiring connection between the main control switching device and the synchronous rectification device, and the external wiring connection between the core power device and the drive control circuit will increase parasitic parameters and reduce reliability

Method used

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  • Monolithic integrated semiconductor chip for chopper circuit and preparation method thereof
  • Monolithic integrated semiconductor chip for chopper circuit and preparation method thereof
  • Monolithic integrated semiconductor chip for chopper circuit and preparation method thereof

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Embodiment Construction

[0050] The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0051] As mentioned in the background art, the existing solution has the problem of large volume occupied by the main control switching device and the synchronous rectification device in the chopper circuit. In view of the above-mentioned defects of the prior art, the embodiment of the present invention considers that the main control switching MOSFET and the synchronous rectification MOSFET in the chopper circuit can be integrated on the same chip, so as to reduce the volume occupied by the main control switc...

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Abstract

The embodiment of the invention provides a monolithic integration semiconductor chip for a chopper circuit and a manufacturing method thereof. The semiconductor chip comprises a main control switch MOSFET, a synchronous rectification MOSFET and a CMOS logic driving chip, wherein the first source region of the main control switch MOSFET and the second drain region of the synchronous rectification MOSFET are interconnected through a metal interconnection wire and used as a first reserved interface VSW for the semiconductor chip; the first gate structure of the main control switch MOSFET and thesecond gate structure of the synchronous rectification MOSFET are connected with output nodes of a first CMOS and a second CMOS in the CMOS logic driving chip; and the first drain region of the main control switch MOSFET leads out a second reserved interface Vin of the semiconductor chip through the metal interconnection wire. When the scheme provided in the embodiment of the invention is applied,the size of the chopper circuit can be reduced, the parasitic parameters are reduced, and the power density and the reliability are thus improved.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of power electronics, and in particular to a monolithic integrated semiconductor chip for a chopper circuit and a manufacturing method thereof. Background technique [0002] A switching power supply is a power supply that uses modern power electronics technology to control the time ratio of switching transistors on and off to maintain a stable output voltage. Switching power supply is generally composed of PWM (Pulse Width Modulation, pulse width modulation) control ICs (Integrated Circuits, integrated circuits) and MOSFET (Metal-Oxide-SemiconductorField-Effect Transistor, Metal-Oxide-Semiconductor Field-Effect Transistor). [0003] With the development and innovation of power electronics technology, switching power supply technology is constantly innovating. At present, switching power supply is widely used in almost all electronic devices due to its small size, light weight and high ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/8234H01L21/8238H01L23/528H01L27/088H01L27/092
CPCH01L21/8234H01L21/823475H01L21/8238H01L23/528H01L27/088H01L27/092
Inventor 王俊彭志高梁世维
Owner HUNAN UNIV