A method of photolithography overlaying surface acoustic wave filter and surface acoustic wave filter
A surface acoustic wave and lithographic overlay technology, applied in the field of surface acoustic wave filter manufacturing, can solve problems such as complex procedures, high cost, and low efficiency, and achieve the effects of reducing wear and improving production efficiency
Active Publication Date: 2020-02-21
北京航天微电科技有限公司
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Problems solved by technology
[0006] The technical problems to be solved by the present invention are: the existing photolithography technology has high cost, complex process and low efficiency
Method used
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Embodiment Construction
[0033] The principles and features of the present invention are described below in conjunction with the accompanying drawings, and the examples given are only used to explain the present invention, and are not intended to limit the scope of the present invention.
[0034] Such as figure 1 As shown, provided in Embodiment 1 of the present invention is a method for photolithographic overlaying of a surface acoustic wave filter, the method comprising:
[0035] S1, making a chip metal pattern on the surface of the piezoelectric substrate;
[0036] S2, performing photoresist uniformization on the surface of the piezoelectric substrate on which the metal pattern of the chip has been prepared;
[0037] S3, baking the piezoelectric substrate after gluing;
[0038] S4, after baking, determine the optimal exposure focal plane DOF of the photoresist layer on the surface of the piezoelectric substrate 0 ;
[0039] S5, according to the best exposure focal plane DOF 0 , to determine th...
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The invention relates to a photoetching overlay method for a surface acoustic wave filter and the surface acoustic wave filter. The method comprises the steps of manufacturing metal chip patterns on the surface of a piezoelectric substrate; carrying out photoresist coating on the surface of the piezoelectric substrate into which the chip patterns are manufactured; carrying out baking after coating; determining an optimal exposure focal plane after baking; determining an exposure focal plane which deviates from the optimal exposure focal plane a preset distance; exposing the baked piezoelectricsubstrate according to preset exposure time; developing the exposed piezoelectric substrate by using a developing liquid; and finally baking the developed piezoelectric substrate by using a hot plateand completing manufacturing of photoresist patterns. The invention further relates to the surface acoustic wave filter. A special pattern overlay mask does not need to be manufactured again and themask does not need to be repeatedly replaced, so that the production efficiency is improved and the abrasion of the mask is reduced.
Description
technical field [0001] The invention belongs to the technical field of surface acoustic wave filter manufacturing, and in particular relates to a method for photolithographically engraving a surface acoustic wave filter and a surface acoustic wave filter. Background technique [0002] The surface acoustic wave filter uses the piezoelectric effect and inverse piezoelectric effect of the material. When the electrical signal is applied to the 7-digit transducer, the surface acoustic wave is excited on the surface of the material. By rationally designing the metal finger on the surface of the material The graphic structure of the transducer couples the acoustic and electrical signals, and finally achieves the purpose of processing the electrical signals. Due to its advantages of small size, light weight, and good performance, it is widely used in the fields of RF front-end circuits of smart mobile communication equipment, radar, satellites, etc. that require signal filtering. ...
Claims
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IPC IPC(8): G03F7/20G03F7/40G03F7/16H03H9/02
CPCG03F7/168G03F7/20G03F7/40H03H9/02
Inventor 贺强段斌王永安范佰杰边旭明史向龙苏波
Owner 北京航天微电科技有限公司