Silicon wafer texturing and transferring device

A technology for transfer devices and silicon wafers, which is applied in the directions of transportation and packaging, final product manufacturing, sustainable manufacturing/processing, etc., can solve problems such as the impact on the quality of silicon wafers, and achieve the effect of ensuring quality and avoiding edge chips
CN107968064AActive Publication Date: 2018-04-27LESHAN TOPRAYCELL
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
LESHAN TOPRAYCELL
Publication Date
2018-04-27

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Abstract

The invention discloses a silicon wafer texturing and transferring device capable of ensuring that a silicon wafer is always kept wet in transferring and lifting processes to avoid the formation of water marks. The silicon wafer texturing and transferring device comprises a mounting base, wherein a turntable is arranged on the mounting base; a vertical sliding column is arranged on the turntable;a sliding table is arranged on the vertical sliding column; a first telescopic device is arranged on the sliding table; one end of the first telescopic device is fixedly connected with the sliding table, and the other end of the first telescopic device is provided with a support arm; one end of the support arm is connected with the telescopic device through a rotational joint; a second turntable is arranged below the other end of the support arm; a second telescopic device is arranged on the second turntable; a lower end of the second telescopic device is provided with a clamping jaw; a nozzleis arranged on the clamping jaw; a booster pump is arranged on the support arm; and the nozzle communicates with the booster pump. Through adoption of the silicon wafer texturing and transferring device, the occurrence of water marks can be avoided, and the quality of products is ensured.
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Description

technical field

[0001] The invention relates to texturing of silicon wafers, in particular to a texturing transfer device for silicon wafers. Background technique

[0002] It is well known that silicon wafers need to be cleaned after a series of processing procedures. The purpose of cleaning is to eliminate all kinds of pollutants adsorbed on the surface of silicon wafers, and to make a suede structure that can reduce the reflection of sunlight on the surface. The degree of cleanliness directly affects the yield and reliability of cells. Texturing is the first process for manufacturing crystalline silicon cells, also known as "surface texturing". The effective textured structure makes the incident light reflect and refract multiple times on the surface of the silicon wafer, which increases the light absorption, reduces the reflectivity, and helps to improve the performance of the battery.

[0003] After the silicon wafer is cleaned, the silicon wafer needs to be transferre...

Claims

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