Packaging structure and packaging method
A technology of encapsulation structure and encapsulation layer, which is applied in the direction of triboelectric generators, etc., and can solve problems affecting the stable operation of triboelectric nanogenerators
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[0024] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.
[0025] An embodiment of the present invention provides a packaging structure, which can be formed by stacking polymer layers and inorganic thin film layers at intervals. Wherein, the polymer layer can be one or more polymer layers, and the inorganic thin film layer can be one or more inorganic thin film layers, that is to say, the packaging structure provided by the embodiments of the present invention can be composed of one or more layers The polymer layer and one or more inorganic thin film layers are formed alternately.
[0026] The packaging structure provided by the embodiments of the present invention can be used for various devices, especially for device...
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