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Device and method for measuring heat transfer coefficient of externally attached surface of heat transfer element by unsteady method

A technology of surface heat transfer coefficient and heat transfer element, applied in the aerospace field, can solve the problems of large time and cost, and achieve the effect of reducing test cost, low cost and shortening test time.

Active Publication Date: 2020-04-21
SHANGHAI SATELLITE ENG INST
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This makes a heat balance test basically need 12 to 16 hours to reach equilibrium, which is time and costly.

Method used

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  • Device and method for measuring heat transfer coefficient of externally attached surface of heat transfer element by unsteady method
  • Device and method for measuring heat transfer coefficient of externally attached surface of heat transfer element by unsteady method
  • Device and method for measuring heat transfer coefficient of externally attached surface of heat transfer element by unsteady method

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Embodiment Construction

[0028] The present invention will be described in detail below in conjunction with specific embodiments. The following examples will help those skilled in the art to further understand the present invention, but do not limit the present invention in any form. It should be noted that those skilled in the art can make several changes and improvements without departing from the concept of the present invention. These all belong to the protection scope of the present invention.

[0029] figure 1 It is a schematic diagram of the device for measuring the heat transfer coefficient between the external contact surfaces of the heat pipe by the unsteady method of the present invention. Wherein, correspondingly, 1 is the structural plate 1, 2 is the heater, 3 is the heat pipe (heat transfer element), 4 is the structural plate 2, and 5 is the multi-layer heat insulation component. The heat pipes are arranged horizontally, and the two ends are respectively connected to the first structu...

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Abstract

The invention provides a device and a method for measuring a heat exchange coefficient of an external sticking surface of a heat transfer element through a non-steady state method. The device is usedfor a thermal vacuum environment and comprises a heater, a structure plate I, the heat transfer element, a structure plate II, a plurality of layers of heat insulation assemblies and thermocouples, wherein the heater is stuck on the structure plate I and a sticking position is a region at the other side corresponding to a connecting position of the structure plate I and the heat transfer element;black paint is sprayed at one side, which is not connected with the heat transfer element, of the structure plate II and is used for radiating and dissipating heat under the vacuum environment; non-paint-spraying parts of the structure plate I, the heat transfer element and the structure plate II are coated with the plurality of layers of heat insulation assemblies; the corresponding thermocouplesare distributed on the outer surfaces of the structure plate I, the structure plate II, the heat transfer element and the plurality of layers of heat insulation assemblies; the heater is used for applying a certain amount of heat to the structure plate I and the heat is transferred to the structure plate II through the heat transfer element; finally, the heat is dissipated in a thermal radiationmanner. Under the condition that thermal balance is not established, the heat exchange coefficient between the structure plate and a heat pipe is calculated under the vacuum environment, and the testing time and the testing cost can be greatly saved.

Description

technical field [0001] The invention relates to the technical field of aerospace and aviation, in particular to a device and method for measuring the heat transfer coefficient of an externally attached surface of a heat transfer element by an unsteady method in a thermal vacuum environment. Background technique [0002] In the outer space environment, the contact surfaces are all in a vacuum state, the amount of gas in the gap between the contact surfaces is very small, and the heat transfer effect of the gas in the gap space can be ignored. The heat transfer coefficient between two contacting surfaces in a vacuum environment is not the same as the test value in the ground atmospheric environment. During the satellite simulation analysis, if the test values ​​under the ground atmospheric environment are used for calculation, the accuracy of the simulation analysis will be reduced. Therefore, a thermal vacuum test must be performed to obtain the heat transfer coefficient bet...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N25/20
CPCG01N25/20
Inventor 陈彬彬付鑫程梅苏江世臣曹建光杨剑康奥峰刘炜葳胡炳亭王彦
Owner SHANGHAI SATELLITE ENG INST
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