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Microwave module structure based on multi-layer wiring

A technology of microwave components and multilayer wiring substrates, which is applied in the direction of waveguide devices, waveguides, electrical components, etc., can solve the problems of microwave signal space radiation affecting the performance of microwave components, achieve effective and feasible structural design methods, improve performance indicators, and structure simple effect

Active Publication Date: 2018-05-01
GUIZHOU AEROSPACE INST OF MEASURING & TESTING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a microwave component structure based on multi-layer wiring to solve the problem that the space radiation of microwave signals and the mutual coupling effect between wires will seriously affect the performance of microwave components

Method used

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  • Microwave module structure based on multi-layer wiring

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Embodiment Construction

[0014] Below in conjunction with accompanying drawing and specific embodiment the invention is further introduced:

[0015] Such as figure 1 As shown, this embodiment is a microwave component structure based on multilayer wiring, including a multilayer wiring substrate 1, the bottom of which is connected to the bottom plate 6, and the bottom plate 6 supports the multilayer wiring substrate 1. The multi-layer wiring substrate 1 is provided with a sub-cavity shielding cover plate 2 which separates the transmission path of the microwave signal along its transmission direction, and a plurality of side-by-side cavities 3 are arranged on the sub-cavity shielding cover plate 2, and each cavity 3 The end face of the cavity wall 4 is connected to the multilayer wiring substrate 1, and a conductive copper layer is coated on the contact surface of the cavity wall 4 on the multilayer wiring substrate 1, and the multilayer wiring substrate 1 at the bottom of the conductive copper layer is ...

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Abstract

The present invention discloses a microwave module structure based on multi-layer wiring. The structure comprises a multi-layer wiring substrate which is provided with a cavity separation shielding cover plate configured to separate a transmission path of microwave signals in a transmission direction of the microwave signals, the cavity separation shielding cover plate is provided with more than one cavities arranged side by side, the cavity wall end faces of the cavities are connected with the multi-layer wiring substrate, the surface, being in contact with the cavity walls, on the multi-layer wiring substrate is coated with a conductive copper layer, and the multi-layer wiring substrate at the bottom portion of the conductive copper layer is provided with grounding holes, so that enclosed and mutually independent separated microwave signal transmission channels are formed. The microwave module structure based on multi-layer wiring employs multi-layer wiring substrate area separation,the cavity separation shielding cover plate to achieve the good shielding cavity separation design of the microwave signals, and compared to a traditional structure with cavity separation, the microwave module structure based on multi-layer wiring greatly reduces the volume of the microwave module, can obtain a good microwave module performance and can effectively reduce the space crosstalk and cross coupling of the microwave signals.

Description

technical field [0001] The invention relates to a microwave component structure based on multilayer routing, and belongs to the technical field of microwave components. Background technique [0002] Microwave components are now developing in the direction of miniaturization and high integration. Multilayer wiring technology has been applied in the circuit design of microwave components, such as low temperature co-fired ceramic technology (LTCC), multilayer mixed pressure printed board technology, etc. The use of multi-layer wiring technology can effectively improve the integration of microwave circuits, and replace the power supply and control line connectors of traditional microwave components with internal wiring on the substrate. The interconnection lines are shorter and the circuit volume of microwave components is greatly reduced. However, microwave circuits are different from low-frequency circuits. The space radiation of microwave signals and the mutual coupling effec...

Claims

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Application Information

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IPC IPC(8): H01P3/12
CPCH01P3/121
Inventor 胡天涛杜勇刘兴
Owner GUIZHOU AEROSPACE INST OF MEASURING & TESTING TECH
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