Printed circuit board substrate, camera module, manufacturing method thereof and electronic equipment

Abstract

The invention provides a printed circuit board substrate, a camera module, a manufacturing method thereof and electronic equipment. The printed circuit board substrate comprises two or more than two sub substrates; the sub substrates are in compression joint through at least one ACF (Anisotropic Conductive Film) adhesive to form the printed circuit board substrate; the width of at least one contact piece of at least one connector of each sub substrate is smaller than that of at least one lead of the at least one connector of each sub substrate; each contact piece is connected with each corresponding lead; and the sub substrate has a covering film windowing distance before compression joint. The printed circuit board substrate can solve the ACF compression short circuit problem, the yield is improved, and the manufacturing cost is reduced.

Description

technical field [0001] The invention relates to the field of optical imaging, in particular to a circuit board substrate, a camera module, a manufacturing method thereof, and electronic equipment based on a high-precision ACF lamination process. Background technique [0002] With the development of high pixel, dual camera and large aperture performance of mobile phone camera modules, the requirements for all aspects of camera modules are getting higher and higher. In the production process of the camera module, the size of the circuit board of the camera module includes a hard board and a soft board. The traditional ACF process is to press the hard board and the soft board together. The full name of ACF is Anisotropic Conductive Film, that is, anisotropic conductive film. It is characterized by conducting only in the Z direction, but not conducting in the X and Y directions. The ACF glue mainly contains conductive particles and insulating plastic parts (mainly thermoplastic ...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a circuit board substrate, camera module and its manufacturing method and electronic equipment, compared with the circuit board substrate formed by the traditional ACF process, it can solve the problem of ACF pressing and short circuit

[0006] Another object of the present invention is to provide a circuit board substrate, a camera module and its manufacturing method, and electronic equipment. In the high-precision ACF lamination process through ACF glue, the conductive particles are prevented from accumulating, thereby solving the problems caused by ACF lamination. short circuit problem

Images