Check patentability & draft patents in minutes with Patsnap Eureka AI!

Circuit board substrate, camera module, manufacturing method thereof, and electronic device

A technology for camera modules and electronic equipment, applied in printed circuit manufacturing, television, printed circuit, etc., can solve problems such as ACF pressing short circuit, short circuit, etc.

Active Publication Date: 2020-10-30
NINGBO SUNNY OPOTECH CO LTD
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a circuit board substrate, camera module and its manufacturing method and electronic equipment, compared with the circuit board substrate formed by the traditional ACF process, it can solve the problem of ACF pressing and short circuit
[0006] Another object of the present invention is to provide a circuit board substrate, a camera module and its manufacturing method, and electronic equipment. In the high-precision ACF lamination process through ACF glue, the conductive particles are prevented from accumulating, thereby solving the problems caused by ACF lamination. short circuit problem

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuit board substrate, camera module, manufacturing method thereof, and electronic device
  • Circuit board substrate, camera module, manufacturing method thereof, and electronic device
  • Circuit board substrate, camera module, manufacturing method thereof, and electronic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] The following description serves to disclose the present invention to enable those skilled in the art to carry out the present invention. The preferred embodiments described below are only examples, and those skilled in the art can devise other obvious variations. The basic principles of the present invention defined in the following description can be applied to other embodiments, variations, improvements, equivalents and other technical solutions without departing from the spirit and scope of the present invention.

[0035] Those skilled in the art should understand that in the disclosure of the present invention, the terms "vertical", "transverse", "upper", "lower", "front", "rear", "left", "right", " The orientation or positional relationship indicated by "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the present invention...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention provides a circuit board substrate, a camera module and its manufacturing method, and electronic equipment. The circuit board substrate includes two or more sub-substrates, and each sub-substrate is connected by at least one ACF adhesive to form the A circuit board substrate, wherein the width of at least one contact of at least one connector of each of the sub-substrates is smaller than the width of at least one lead of at least one connector of each of the sub-substrates, wherein each of the contacts is connected to a corresponding lead wires, and the sub-substrate has a cover film window opening distance before being press-fitted and connected. The circuit board substrate can solve the problem of ACF press-fit short circuit, improve yield rate and reduce manufacturing cost.

Description

technical field [0001] The invention relates to the field of optical imaging, in particular to a circuit board substrate, a camera module, a manufacturing method thereof, and electronic equipment based on a high-precision ACF lamination process. Background technique [0002] With the development of high pixel, dual camera and large aperture performance of mobile phone camera modules, the requirements for all aspects of camera modules are getting higher and higher. In the production process of the camera module, the size of the circuit board of the camera module includes a hard board and a soft board. The traditional ACF process is to press the hard board and the soft board together. The full name of ACF is Anisotropic Conductive Film, that is, anisotropic conductive film. It is characterized by conducting only in the Z direction, but not conducting in the X and Y directions. The ACF glue mainly contains conductive particles and insulating plastic parts (mainly thermoplastic ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/14H05K3/36H04N5/225
CPCH05K1/147H05K3/365H05K2201/09427H04N23/57
Inventor 张银波郭巍
Owner NINGBO SUNNY OPOTECH CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com