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Low-temperature lead-free solder alloy

A lead-free solder alloy, low-temperature technology, applied in the direction of welding/cutting media/materials, welding media, welding equipment, etc., can solve the problems of reducing the brittleness of solder solder joints, low strength of solder joints, and reducing joint brittleness, etc., to achieve improved Welding performance, preventing the generation of Bi-rich phase, and improving the effect of mechanical properties

Inactive Publication Date: 2018-05-04
KUNMING UNIV OF SCI & TECH +1
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Problems solved by technology

[0004] Aiming at the problems existing in the low-temperature lead-free solder in the prior art, the present invention provides a low-temperature lead-free solder alloy, which improves the enrichment of Bi in the solder alloy through the composite addition of various trace elements, thereby reducing the brittleness of the solder joint, At the same time,

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  • Low-temperature lead-free solder alloy
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  • Low-temperature lead-free solder alloy

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Embodiment 8

[0047] The load-displacement curve obtained after the low-temperature lead-free solder alloy SnBi42Sb1.0In1.0 sample tensile test of embodiment 8 is as follows figure 1 Shown, the load-displacement curve of comparative example SnBi58 alloy is as figure 2 shown, from figure 1 and figure 2 It can be seen from the curve that the low-temperature lead-free solder alloy SnBi42Sb1.0In1.0 of Example 8 not only has a higher tensile strength, but also has relatively uniform deformation during the deformation stage of the alloy and has good formability.

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Abstract

The invention discloses a low-temperature lead-free solder alloy, and belongs to the technical field of electronic welding. The low-temperature lead-free solder alloy comprises, by weight percentage,20-50% of Bi, 0.5-10% of Sb, 0.5-10% of In, 0-0.20% of Ge and 0-0.11% of P; two or more than two types of 0-0.2% of Ni, 0-0.2% of Co, 0-0.11% of Ga, 0-0.2% of Si, 0-0.5% of Al and 0-0.5% of Zn; and the balance of Sn and inevitable impurities. According to the low-temperature lead-free solder alloy, multi-element alloy elements such as the Sb, the In, the Ni, the Co, the Ge and the like are added so that the mechanical performance of the solder alloy can be obviously changed; and in formed welding spots and interfaces, the multi-element alloy elements in the dispersed distribution block enrichment of the Bi and prevent generation of rich Bi phases, so that damage of the hard and brittle rich Bi phases to the mechanical property of welding joints is reduced, and the welding performance of the solder alloy is improved.

Description

technical field [0001] The invention relates to a low-temperature lead-free solder alloy, which belongs to the technical field of electronic welding. Background technique [0002] Electronic waste pollutes the environment a lot. In order to protect the environment, lead-free solder has been used to replace traditional lead solder in the field of packaging and soldering of electronic components. At present, the lead-free solder alloys that are widely used are mainly SnCu-based and SnAgCu-based alloy solders. Compared with tin-lead eutectic solders, the melting points of SnCu-based and SnAgCu-based alloy solders are about 30°C higher, and the soldering process temperature is higher. However, with the continuous advancement of Moore's Law, chips are becoming more and more highly integrated and thinner, which makes chips more prone to warping during electronic assembly, resulting in defects such as pillows, bridges, and poor wetting. In order to solve this problem, it is necess...

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Application Information

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IPC IPC(8): B23K35/26
CPCB23K35/262B23K35/264
Inventor 严继康陈东东白海龙刘宝权吕金梅滕媛徐凤仙秦俊虎古列东武信朵云琨甘国友易健宏甘有为刘明陈俊宇顾鑫
Owner KUNMING UNIV OF SCI & TECH
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