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A hole-opening device for a micro-electromechanical device and a reuse method for its preparation

A technology of electrical devices and microcomputers, applied in the processing field of micro-electromechanical devices, can solve the problems of large wafer area, increase chip size and cost, etc., and achieve the effects of reducing area and cost, good sealing and high reliability

Inactive Publication Date: 2020-09-29
CHENGDU CORPRO TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For devices such as gyroscopes that require more signal electrodes, the lead holes will consume a huge wafer area, thereby greatly increasing the size and cost of the chip

Method used

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  • A hole-opening device for a micro-electromechanical device and a reuse method for its preparation
  • A hole-opening device for a micro-electromechanical device and a reuse method for its preparation
  • A hole-opening device for a micro-electromechanical device and a reuse method for its preparation

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] Such as figure 1 , 2 As shown, a hole-opening device of a MEMS device includes a bottom layer and a cap layer connected to the bottom layer by bonding; the bottom layer includes a bottom plate 11, a structural layer 10 connected to the bottom plate 11 by bonding, and the bottom layer 11 is etched There is a first movable structure cavity 111, and an isolation groove 13, a movable structure 101 and a fixed structure 102 are etched on the structural layer 10, and the fixed structure 102 includes a first fixed structure 102-1, a second fixed structure 102-2, The third fixed structure 102-3, the fourth fixed structure 102-4, the isolation groove 13 isolates the electricity in each fixed structure from each other, the fixed structure 102 and the movable structure 101 are connected together through the suspension structure; the capping layer includes the top plate 12, the top plate 12 and the structural layer 10 are connected by bonding. The front of the top plate 12 is etch...

Embodiment 2

[0061] Such as figure 1 , 2 As shown, a hole-opening device of a MEMS device includes a bottom layer and a cap layer connected to the bottom layer by bonding; the bottom layer includes a bottom plate 11, a structural layer 10 connected to the bottom plate 11 by bonding, and the bottom layer 11 is etched There is a first movable structure cavity 111, and an isolation groove 13, a movable structure 101 and a fixed structure 102 are etched on the structural layer 10, and the fixed structure 102 includes a first fixed structure 102-1, a second fixed structure 102-2, The third fixed structure 102-3, the fourth fixed structure 102-4, the isolation groove 13 isolates the electricity in each fixed structure from each other, the fixed structure 102 and the movable structure 101 are connected together through the suspension structure; the capping layer includes the top plate 12, the top plate 12 and the structural layer 10 are connected by bonding. The front of the top plate 12 is etch...

Embodiment 3

[0080] Such as figure 1 , 2 As shown, a hole-opening device of a MEMS device includes a bottom layer and a cap layer connected to the bottom layer by bonding; the bottom layer includes a bottom plate 11, a structural layer 10 connected to the bottom plate 11 by bonding, and the bottom layer 11 is etched There is a first movable structure cavity 111, and an isolation groove 13, a movable structure 101 and a fixed structure 102 are etched on the structural layer 10, and the fixed structure 102 includes a first fixed structure 102-1, a second fixed structure 102-2, The third fixed structure 102-3, the fourth fixed structure 102-4, the isolation groove 13 isolates the electricity in each fixed structure from each other, the fixed structure 102 and the movable structure 101 are connected together through the suspension structure; the capping layer includes the top plate 12, the top plate 12 and the structural layer 10 are connected by bonding. The front of the top plate 12 is etch...

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Abstract

The invention discloses a trepanning device of a microelectromechanical device and a multiplexing method of preparation thereof. The method comprises a bottom layer process, a cap process and a metallization process. The device is sealed by bonding a bottom layer with a cap, and then a metal layer is patterned to lead out a signal; and the device comprises a structural layer that is divided into fixed structures and a movable structure, two glass layers distributed at the top and the bottom for providing an airtight environment, a movable cavity for the movement of the movable structure, isolation grooves for realizing electrical isolation among several fixed structures, a metal lead for leading out signals from the upper surface of the glass at the top, and a bonding pad. Compared with the manner of leading out a signal line by using a lead hole in the traditional process, the trepanning device disclosed by the invention has the advantages of leading out a plurality of signal lines through a lead hole, thereby reducing the number of lead holes needed on a chip, and accordingly the area and the cost of the chip are reduced.

Description

technical field [0001] The invention relates to a processing method of a micro-electro-mechanical device, in particular to a device for opening holes of a micro-electro-mechanical device and a manufacturing reuse method thereof. Background technique [0002] With the development of micromechanical technology, more and more MEMS devices have been commercialized and even military used in recent years. Among them, MEMS devices have achieved great success in automotive electronics, inertial navigation and portable electronic equipment. [0003] Since the MEMS process is usually a planar process, MEMS devices usually use a non-enclosed structure + edge wiring or a closed structure + top / bottom wiring for signal extraction considerations. Considering that MEMS devices such as inertial devices and pressure sensors require airtight / vacuum packaging, the solution of closed structure + top / bottom wiring can meet the requirements of signal extraction and wafer-level packaging at the s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81C1/00
CPCB81C1/00087
Inventor 梁冰
Owner CHENGDU CORPRO TECH CO LTD