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speaker pad

A speaker foot pad and foot pad technology, applied in the field of speaker foot pads, can solve the problems of speaker jumping or position deviation, affecting the sound quality of the speaker, and damaging surrounding objects, etc., to reduce the contact area, facilitate replacement and heat dissipation, The effect of reducing the vibration effect

Active Publication Date: 2021-03-12
BEIJING KUWO TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] When the speaker is working, it will generate sound by agitating the air. The sound wave vibration will directly act on the contact surface, and the reaction force of the vibration will act on the speaker, causing superimposed vibration and instability, causing the speaker itself to jump or shift its position, thus affecting At the same time, the vibration of the speaker base and the contact surface will cause additional noise, or drive other surrounding items to vibrate, thus damaging the surrounding items

Method used

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Embodiment Construction

[0021] The present invention will be further described below through the accompanying drawings and specific embodiments, but it should be understood that these embodiments are only used for more detailed description, and should not be construed as limiting the present invention in any form, that is, not intended To limit the protection scope of the present invention.

[0022] figure 1 It shows the lower surface structure of the sound box foot pad provided by an embodiment of the present invention, image 3 It shows one of the side view structures of the sound box foot pad provided by an embodiment of the present invention, Figure 4 It shows the second structure of the side view of the sound box foot pad provided by an embodiment of the present invention.

[0023] Such as figure 1 , image 3 and Figure 4 As shown, a sound box foot pad in this embodiment includes: a foot pad body 1, the upper surface of which is installed on the sound box base, and the lower surface is in...

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Abstract

The invention relates to a sound box foot pad, comprising a foot pad body, the upper surface of the foot pad body is installed on the sound box base, and the lower surface is in contact with the supporting surface on which the sound box is placed; wherein, the lower surface of the foot pad body is set as The arc structure is provided with a plurality of raised support points on the lower surface of the arc structure. The arc-shaped structure design of the sound box foot pad body for shock absorption provided by the present invention increases the buffer distance, and at the same time, a plurality of raised support points are arranged on the lower surface of the arc-shaped structure, which reduces the distance between the foot pad body and The contact area of ​​the supporting surface, and the internal design of the raised supporting point is a hollow structure, forming a shock-absorbing buffer space, which further increases the buffering distance, minimizes the vibration effect, and prevents the speaker from vibrating or moving.

Description

technical field [0001] The invention relates to the technical field of audio equipment, in particular to a sound box foot pad. Background technique [0002] When the speaker is working, it will generate sound by agitating the air. The sound wave vibration will directly act on the contact surface, and the reaction force of the vibration will act on the speaker, causing superimposed vibration and instability, causing the speaker itself to jump or shift its position, thus affecting At the same time, the vibration of the speaker base and the contact surface will cause additional noise, or drive other surrounding items to vibrate, thereby damaging the surrounding items. In order to reduce the adverse effects caused by the vibration, and to obtain higher-quality sound effects, there is an urgent need for a device or device to buffer the vibration generated by the sound box during operation. Contents of the invention [0003] The purpose of the present invention is to address th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R1/02
CPCH04R1/026
Inventor 王征陈传波李俊珂刘鹏江
Owner BEIJING KUWO TECH