Quality tracing method for multi-layer PCB

A high-quality, multi-layer board technology, applied in the direction of electrical components, printed circuit parts, printed circuits, etc., can solve the problems of easy data loss identification and adverse effects, and achieve the effect of ensuring accurate identification and preventing loss

Active Publication Date: 2018-05-08
GUANGDONG ZHENGYE TECH
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Problems solved by technology

[0007] The purpose of the present invention is to provide a quality traceability method for multi-layer PCBs, which overcomes the defects that the

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  • Quality tracing method for multi-layer PCB

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Embodiment Construction

[0029] In order to make the purpose, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the following The described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0030] The core idea of ​​the present invention is: aiming at the defects of two-dimensional codes in certain processes, in the whole production process of multi-layer PCB, the corresponding two-dimensional codes are first generated for each core board, and the corresponding two-dimensional codes are generated from the cutting process to t...

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Abstract

The invention relates to the field of PCBs, and discloses a quality tracing method for a multi-layer PCB. The quality tracing method comprises the steps of distributing a unique two-dimensional code for each core board in a board cutting procedure, converting each two-dimensional code into a unique hole array code and then drilling the unique array code on the corresponding core board; reading thehole array code on each core board in a laminating procedure, combining all of the read hole array codes into a corresponding unique two-dimensional code, then converting the two-dimensional code into a unique hole array code, and drilling the unique hole array code on a laminated multi-layer board; and reading the hole array code on the multi-layer board after a resistance welding procedure, converting the hole array code into a corresponding two-dimensional code, and marking the two-dimensional code on the multi-layer board. The embodiment of the invention can ensure accurate recognition ofa tracing identifier in each procedure in the manufacturing process of the multi-layer PCB, thereby laying a foundation for realizing whole-process quality monitoring for products; and the transfer of information from an inner layer to an outer layer is realized in the laminating procedure, thereby preventing the loss of the information in the inner layer, and being capable of realizing whole-life-cycle tracing for the products.

Description

technical field [0001] The invention relates to the technical field of PCB (Printed Circuit Board, printed circuit board), in particular to a quality traceability method of a multilayer PCB. Background technique [0002] Traceability of the cause of product problems is a serious challenge for manufacturers in every industry, from automotive to aerospace, from medical to food. In an era of globalization, businesses pursue relationship management to maximize customer satisfaction. Consumer and environmental regulations are becoming stricter, making traceability even more necessary. [0003] More than ever, manufacturers are looking to maximize production capacity and reduce costs. To achieve this goal, every step in the entire manufacturing process must be monitored and complete historical records kept. Issues affecting product quality must be quickly identified and corrected to prevent defective products from continuing down the production line, with the ultimate goal of a...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K1/02
CPCH05K1/0266H05K3/00H05K2201/09927
Inventor 廉世周赵冶蓝薇宋国营徐地华梅领亮
Owner GUANGDONG ZHENGYE TECH
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