Model solid conductive hot melting silver glue

A technology of conductive silver glue and polyurethane hot-melt glue, which is applied in the direction of conductive adhesives, adhesives, epoxy resin glue, etc., can solve the problems of increasing initial investment and production costs, film layer failure, silver layer bursting, etc., to achieve easy Effects of storage and processing operations, numerical stability, and high economic value

Inactive Publication Date: 2018-05-18
天津瑞爱恩科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are strict transportation and storage requirements, and usually need to be stored at low temperature and used in a very short time after opening, which is very easy to cause waste in normal production; dispensing equipment is required in production, which increases the initial investment and production costs
Liquid silver glue has good adhesion and electrical properties after curing, but after welding, the silver layer explodes, cracks, and the film layer fails completely.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] A type of solid-state conductive hot-melt silver glue, which consists of: conductive silver glue matrix, micron silver powder, nano-silver powder, the parts by weight of the conductive silver glue matrix is ​​10 to 50 parts, the parts by weight of the micron silver powder The number is 1-40 parts, and the weight part of the nano-silver powder is 10-60 parts.

Embodiment 2

[0027] A type of solid-state conductive hot-melt silver glue described in embodiment 1, the parts by weight of the conductive silver glue matrix is ​​10 parts, the parts by weight of the described micron silver powder is 1 part, and the parts by weight of the nano silver powder are The parts by weight are 10 parts.

Embodiment 3

[0029] A type of solid-state conductive hot-melt silver glue described in embodiment 1, the parts by weight of the conductive silver glue matrix is ​​50 parts, the parts by weight of the described micron silver powder is 40 parts, and the parts by weight of the described nano-silver powder The parts by weight are 60 parts.

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PUM

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Abstract

The invention discloses a model solid conductive hot melting silver glue, which is prepared from conductive silver glue matrix, micron silver powder and nano silver powder; the model solid conductivehot melting silver glue is characterized in that the conductive silver glue matrix is 10-50 parts by weight, micron silver powder is 1-40 parts by weight and nano silver powder is 10-60 parts by weight. The invention is applied to the solid conductive hot melting silver glue.

Description

Technical field: [0001] The invention relates to a type of solid conductive hot-melt silver glue. Background technique: [0002] Conductive silver glue is widely used in electronics, information, electroplating and other industries, and is mainly used for conductive bonding between objects. Conductive silver glue is widely used in electromagnetic shielding, electroplating pre-coating and flexible circuit boards (PEI, PI) and other substrates to form conductive lines and other fields. [0003] The existing conductive silver glue usually adopts epoxy resin as the matrix resin of conductive silver glue, adds flexible macromolecules such as rubber, and uses long-chain flexible amine as curing agent to improve the brittleness of epoxy resin to obtain flexible and elastic conductive silver glue. Conductive silver glue is in liquid state. It has strict transportation and storage requirements, and usually requires low temperature storage and needs to be used in a very short time a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J9/02C09J11/04C09J163/00C09J175/06
CPCC08K2003/0806C08K2201/011C08K2201/014C09J9/02C09J11/04C09J163/00C09J175/06
Inventor 李雁滨
Owner 天津瑞爱恩科技有限公司
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