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Temperature sensor device

A technology for temperature sensors and mounting parts, which can be used in thermometers, measuring devices, resistors with positive temperature coefficients, etc., and can solve problems such as peeling off of thermal-sensitive element metal plates

Active Publication Date: 2020-12-18
TDK CORPARATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in the conventional temperature sensor device, there is a technical problem that the thermosensitive element is easily peeled off from the metal plate serving as the element mounting part together with the insulating resin.

Method used

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Experimental program
Comparison scheme
Effect test

no. 1 approach

[0057] Such as figure 1 and figure 2 As shown, a temperature sensor device 2 according to one embodiment of the present invention has a thermosensitive element 4 . The thermosensitive element 4 has an element body 6 and a coating layer 7 covering the outer periphery of the element body 6 .

[0058] The element body 6 is not particularly limited as long as it can detect temperature, and for example, an NTC (Negative Temperature Coefficient) thermistor element, a PTC (Positive Temperature Coefficient, Positive Temperature Coefficient) thermistor element, etc. can be used. The cover layer 7 can be made of insulating resin, glass, or the like. The resin constituting the coating layer 7 is not particularly limited, and for example, epoxy resin, urethane resin, silicone resin, ABS resin, PPS resin, PBT resin, etc. can be used. In addition, the glass constituting the cladding layer 7 is not particularly limited.

[0059] Such as figure 2 As shown, a pair of core wires 8a of le...

no. 2 approach

[0079] Such as Figure 6 As shown, the temperature sensor device 2a of the present embodiment is different from the first embodiment only in the structure in which the metal fitting 10a is attached, and is the same as the temperature sensor device 2 of the first embodiment except for the structure and effects shown below, and in Common parts are denoted by common symbols, and illustrations and descriptions of common parts are omitted.

[0080] Such as Figure 6 As shown, in this embodiment, the mounting bracket 10 a has a cylindrical portion 17 formed by integrally connecting upper ends of a pair of side walls 14 with an upper wall 15 so as to cover the four sides around the thermosensitive element 4 . An inner convex portion 20 is formed on the inner surface of the cylindrical portion 17 . In this embodiment, the inner convex portion is not only on the inner surface 14d of the side wall 14 but also on the inner surface 12d of the bottom wall 12 and the inner surface 15d of ...

no. 3 approach

[0083] Such as Figure 7 As shown, the temperature sensor device 2b of this embodiment differs from the first embodiment only in the inclination angle θ of the thermal sensor 4 and the lead wire 8 relative to the mounting metal part 10, and is different from the first embodiment except for the structure and effects shown below. The embodiment and the second embodiment are the same, and the common parts are given the same symbols, and the illustration and description of the common parts are omitted.

[0084] Such as Figure 7 As shown, in this embodiment, the thermosensitive element 4 and the lead wire 8 are inclined at an inclination angle θ of about 0 to 30 degrees with respect to the plane of the bottom plate 12 of the mounting metal fitting 10 . In this state, the front end portion of the heat sensitive element 4 is mounted on the mount through the adhesive resin 30 present in the space surrounded by the bottom wall 12 and the pair of side walls 14 of the mount metal fitti...

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Abstract

The invention provides a temperature sensor device that can be easily mounted with respect to an object whose temperature is to be detected, and a heat-sensitive element is not easily peeled off. Thetemperature sensor device (2) has a heat-sensitive element (4), a mounting metal member (10) on which the heat-sensitive element (4) is mounted, and an adhesive resin (30) filled in the gap between the mounting metal member (10) and the heat-sensitive member (4). The mounting metal member (10) has an inner projection (20) protruding from the inner surface (14d) of the side wall (14) of the metal member (10) toward the adhesive resin (30).

Description

technical field [0001] The present invention relates to a temperature sensor device which can be easily installed with respect to an object whose temperature is to be detected and whose heat-sensitive element is not easily peeled off. Background technique [0002] As a temperature sensor device that can be easily attached to an object whose temperature is to be detected, for example, a temperature sensor device disclosed in Patent Document 1 below is known. In this temperature sensor device, a metal plate is attached to a thermosensitive element using an insulating resin, and the metal plate is attached to a temperature measurement object. [0003] However, in the conventional temperature sensor device, there is a technical problem that the thermosensitive element is easily peeled off from the metal plate serving as the element mounting portion together with the insulating resin. [0004] prior art literature [0005] patent documents [0006] Patent Document 1: Japanese ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01C1/01H01C7/02H01C7/04G01K7/22
CPCG01K7/22H01C1/01H01C7/02H01C7/04
Inventor 若林裕今野勇喜
Owner TDK CORPARATION