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A kind of anti-displacement pcb board drilling method

A technology of PCB board and drilling method, which is applied in the field of anti-displacement PCB board drilling, can solve the problems of difficult inspection of laser drilling and mechanical drilling dislocation, scrapped production boards, etc., to improve efficiency and improve yield rate Effect

Active Publication Date: 2020-03-24
江门市奔力达电路有限公司
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Problems solved by technology

After mechanical drilling, it is difficult to check the misalignment of laser drilling and mechanical drilling after drilling. It can only be checked with film alignment in the dry film process. However, if the laser drilling tape and mechanical drilling tape are not aligned match, the production board has been scrapped

Method used

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  • A kind of anti-displacement pcb board drilling method

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Embodiment Construction

[0018] refer to figure 1 , a dislocation-proof PCB board drilling method of the present invention,

[0019] Including the following process steps:

[0020] Laser drilling: using laser hole forming technology to process holes on the PCB board to obtain laser holes;

[0021] Mechanical drilling: use the drill bit to drill the PCB board to obtain the mechanical hole 1;

[0022] In the described laser drilling step, laser hole forming technology is also utilized around the processing position of the mechanical drilling step, with the machining center of the mechanical drilling step as the center of the circle to set several laser marking holes 2, the center of circle of the marking hole is The distance from the machining center of the mechanical drilling step is equal to the sum of the radius of the mechanical hole 1, the radius of the laser marking hole 2, and the distance required by the production error.

[0023] Compared with the prior art, by setting several laser marking ...

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Abstract

The invention discloses an anti-dislocation PCB drilling method. The method comprises the following process steps: laser drilling is carried out: a laser pore forming technology is used to process a pore in the PCB to obtain a laser pore; and mechanical drilling is carried out: a bit is used to carry out drilling on the PCB to obtain a mechanical pore. In the laser drilling step, the laser pore forming technology is also used to arrange a plurality of laser marking holes in a surrounding mode around the processing position in the mechanical drilling step and with the processing center in the mechanical drilling step as a circle center, and the distance between the circle center of the marking hole and the processing center in the mechanical drilling step is the sum of the radius of the mechanical hole, the radius of the laser marking hole and a distance required by production errors. In comparison with the prior art, through arranging a plurality of laser marking holes to surround themechanical hole, whether serious dislocation happens to the mechanical hole after processing can be intuitively distinguished, the processing efficiency is effectively improved, and besides, after dislocation is found out, the device is adjusted timely, and the yield improvement can also be improved.

Description

technical field [0001] The invention relates to the field of PCB production, in particular to a PCB board drilling method for preventing dislocation. Background technique [0002] At present, the expansion and contraction of multiple boards are measured after laser drilling, and the coefficient compensation is performed on the drill tape of the mechanical drilling after averaging the expansion and contraction data. After mechanical drilling, it is difficult to check the misalignment of laser drilling and mechanical drilling after drilling. It can only be checked with film alignment in the dry film process. However, if the laser drilling tape and mechanical drilling tape are not aligned Match, the production board has been scrapped. This method greatly reduces the yield rate of the product and increases the production cost. Contents of the invention [0003] The present invention aims to solve one of the above-mentioned technical problems in the related art at least to a ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00B23K26/382
CPCB23K26/382H05K3/00H05K3/0047
Inventor 杨仕德谢宇光钟华爱胡雁云颜运能
Owner 江门市奔力达电路有限公司
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