Semiconductor test mechanism
A testing organization and semiconductor technology, applied in the direction of single semiconductor device testing, measuring electricity, measuring devices, etc., can solve problems such as difficulty in ensuring the long-term development of semiconductor manufacturing enterprises, high failure rate of electronic products, and inability to guarantee the quality of electronic products. , to achieve the effect of saving labor costs
Inactive Publication Date: 2018-05-25
扬州泽旭电子科技有限责任公司
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Problems solved by technology
[0002] With the continuous development of my country's electronics industry, more and more semiconductor manufacturers have expanded their production scale, but with the development and growth of semiconductor companies, more and more semiconductor companies need to improve the quality of their products to ensure The market share of products. At present, many semiconductor manufacturers rely on manual screening of semiconductor components. It is difficult to guarantee the quality of semiconductor components under manual operations. Some semiconductor components with poor quality will be applied to electronic products. In the production process, the failure rate of electronic products produced in this way is very high, so that the quality of electronic products cannot be guaranteed, which will lead to the production reputation of semiconductor manufacturers, and it is difficult to guarantee the long-term development of semiconductor manufacturers
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[0011] The present invention will be further described below in conjunction with the accompanying drawings.
[0012] A semiconductor testing mechanism, comprising a base plate 1, a test main body support 2, a test lifting plate 3, a test lower pressure plate 4, a servo motor 5 and a measuring needle 6, the base plate 1 is connected with the test main body support 2 through a straight plate, and the test main body support 2 is provided with There is a cam 7, the cam 7 is connected with the servo motor 5, the test lifting plate 3 is arranged above the test main support 2, the test lifting plate 3 is connected with the test main support 2 through a connecting rod, and the rear stylus base 8 is provided under the stylus 6, The end of the rear stylus base 8 is provided with a stylus base 9 , the top of the stylus base 9 is provided with a stylus lifting plate 10 , and a test lower pressure plate 11 is provided above the stylus lifting plate 10 . There is a test thimble 12 on the st...
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A semiconductor test mechanism includes a base plate, a test main body support, a test lifting plate, a test lower press plate, a servo motor and a test pin. The base plate is connected with the testmain body support through a straight plate. The test main body support is provided with a cam. The cam is connected with the servo motor. The test lifting plate is arranged above the test main body support. The test lifting plate is connected with the test main body support through a connecting rod, and the connecting rod drives the test lifting plate to move up and down, so that semiconductor components can be sorted quickly. Meanwhile, a test positioning block and a test holding pin are arranged on a test pin pedestal, so the performance of the semiconductor components can be tested quickly.
Description
technical field [0001] The invention relates to a shape testing mechanism, in particular to a semiconductor testing mechanism. Background technique [0002] With the continuous development of my country's electronics industry, more and more semiconductor manufacturers have expanded their production scale, but with the development and growth of semiconductor companies, more and more semiconductor companies need to improve the quality of their products to ensure The market share of products. At present, many semiconductor manufacturers rely on manual screening of semiconductor components. It is difficult to guarantee the quality of semiconductor components under manual operations. Some semiconductor components with poor quality will be applied to electronic products. In the production process, the failure rate of electronic products produced in this way is very high, so that the quality of electronic products cannot be guaranteed, which will lead to the production reputation of ...
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IPC IPC(8): G01R31/26
CPCG01R31/2601
Inventor 芦俊
Owner 扬州泽旭电子科技有限责任公司