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Semiconductor device packaging structure

A device packaging and semiconductor technology, applied in semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve problems such as separation

Active Publication Date: 2021-06-04
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the lid may separate from the substrate due to expansion of trapped air or other fluids produced by thermal cycling (for example, a semiconductor package may be heated to cure the glue between the lid and substrate)

Method used

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  • Semiconductor device packaging structure
  • Semiconductor device packaging structure
  • Semiconductor device packaging structure

Examples

Experimental program
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Embodiment Construction

[0022] Spatial descriptions such as "above", "below", "top", "left", "right", "bottom", "top", "bottom", "vertical", "horizontal", "side", " Higher, "lower", "upper", "lower", "above", "below", etc., describe a definite element or group of elements, or a definite element or group of elements plane for component orientation as shown in the associated drawings. It should be understood that the spatial illustrations used herein are for illustration purposes only, and that embodiments of structures described herein may be spatially arranged in any orientation or manner, and that the advantages of the embodiments of the present invention are not deviating from such an arrangement .

[0023] Figure 1A is a perspective view of a semiconductor device package 1 according to some embodiments of the present invention. The semiconductor device package 1 includes a carrier 10, a cover 11, chips 12 and 13, a solder resist layer 15, cavities A and B, and a space C.

[0024] The carrier 1...

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PUM

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Abstract

A semiconductor device package includes a carrier with through holes. The cover is above the carrier and includes a first side wall, a second side wall and a connecting wall. The second side wall is opposite to the first side wall, and the connecting wall is located between the first side wall and the second side wall. The cover and carrier form a plurality of chambers. The first side wall, the second side wall and the connecting wall form a space for fluidly connecting the plurality of chambers.

Description

technical field [0001] The invention relates to a packaging structure of a semiconductor device. More particularly, the present invention relates to a semiconductor device packaging structure that avoids degradation caused by thermal cycling. Background technique [0002] During the process of packaging semiconductor devices, covers are used to protect chips and other electronic devices on substrates from moisture, dust, particles, etc. A cover is bonded to the substrate to form a semiconductor device package. However, the lid may separate from the substrate due to expansion of trapped air or other fluids produced by thermal cycling (eg, a semiconductor package may be heated to cure glue between the lid and substrate). This effect is known as the "pop-corn" effect. [0003] It is against this background that the packaging structures and associated methods described in the present invention need to be developed. Contents of the invention [0004] One aspect of the prese...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/31
CPCH01L23/31H01L23/04H01L21/6836H01L2221/68331H01L23/053H01L23/10B81B7/0061B81C1/00269B81B7/0032B81C1/00309
Inventor 房昱安陈盈仲黄政羚
Owner ADVANCED SEMICON ENG INC