Trace explosive and poison detector and using method thereof
A technology for detectors and explosives, applied in the field of trace explosives and drug detectors, can solve the problems of only one-time use, difficult recycling, gas detection, etc., and achieve the effect of low cost, super high sensitivity and simple structure
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[0065] Example 1
[0066] 1. Cleaning the substrate 3. Take a 2-inch silicon wafer, use acetone, ethanol, and deionized water for ultrasonic cleaning for ten minutes, and dry it in a nitrogen stream. figure 2 Shown.
[0067] 2. Lithography process. A layer of photoresist was spin-coated on the 3 sides of the substrate using the KW-5 type homogenizer of the Institute of Microelectronics of the Chinese Academy of Sciences, and the photoresist model used was AR-P3510T positive photoresist from Germany Allresist. The gluing process is to rotate at a low speed of 800 rpm for 10 seconds; then rotate at a high speed of 3000 rpm for 50 seconds. Remove the substrate, place it on a 120℃ electric hot plate and bake for 60 s. Take out the substrate 3, and use the MA6 UV lithography machine of German SUSS company to photoetch the substrate 3. The total size of the photoetching board is 5cm×5cm square array, and the photoetching plate material is a quartz glass plate coated with a square Cr ...
Example Embodiment
[0080] Example 2
[0081] 1. Cleaning the substrate 3. Take a 2-inch quartz wafer, wash it with acetone, ethanol, and deionized water sequentially for ten minutes, and dry it in a nitrogen stream.
[0082] 2. Lithography process. A layer of photoresist was spin-coated on the surface of the substrate 3 using the KW-5 type homogenizer of the Institute of Microelectronics of the Chinese Academy of Sciences, and the photoresist model used was AR-P3510T positive photoresist from Germany Allresist Company. The gluing process is to rotate at a low speed of 800 rpm for 10 seconds; then rotate at a high speed of 3000 rpm for 50 seconds. Remove the substrate 3, place it on a 120℃ electric hot plate and bake it for 60 s. Take out the substrate 3, and use the MA6 UV lithography machine of Suss Company in Germany to perform photoetching on the substrate 3. The total size of the photoetching board is 5cm×5cm square array, and the material of the photoetching board is a quartz glass plate coat...
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