Mask plate and fabrication method thereof

Abstract

The invention relates to a mask plate and a fabrication method thereof. The method comprises the steps that a mask plate raw material is provided; one side of the mask plate raw material is etched sothat the thickness of the mask plate raw material can be reduced; the etched side of the mask plate raw material is subjected to smooth polishing treatment; the smoothly polished mask plate raw material is etched, pixel openings are etched in the mask plate raw material, and the mask plate with the pixel openings is formed. Firstly, through etching, the thickness of the mask plate raw material isreduced, after the mask plate is subjected to smooth polishing treatment, the mask plate with a smaller pixel opening interval can be etched out of the mask plate raw material, and thus the vapor deposition PPI of the mask plate is improved; and it is effectively avoided that the mask plate is etched through, the structure of the mask plate can be more steady, the tensile performance of the mask plate can be better, and the service life of the mask plate is effectively prolonged.

Description

technical field [0001] The invention relates to the technical field of organic light-emitting display manufacturing, in particular to a mask plate and a manufacturing method thereof. Background technique [0002] In the AMOLED (Active-matrix organic light emitting diode, active matrix organic light emitting diode) production process, the evaporation process is the most influential factor in the yield rate. The basic process of the evaporation process is to heat the organic material to evaporate the organic material. And the through hole etched through the high-precision fine mask plate and the manufacturing method thereof is vapor-deposited on the glass substrate to form a light-emitting unit. [0003] PPI (pixels per inch, the number of pixels per inch) is the unit of image resolution, indicating the number of pixels per inch. Therefore, the higher the PPI value, it means that the display screen can display images with higher density. Of course, the higher the density dis...

AI Technical Summary

Problems solved by technology

The thickness of the existing high-precision fine mask is more than 30 μm. When making a high-PPI (PPI greater than 400) high-precision fine mask, it is necessary to etch more pattern openings on the mask, and the pattern openings are denser. , the distance between the pattern openings is even smaller. If the existing high-precision fine mask is used, the evaporation surface of the high-precision fine mask will be cut through, so that the adjacent pixel openings will be penetrated, thereby affecting the high precision. Fine Mask Tensile Performance and Subsequent Service Life

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