High and low temperature test device of integrated circuit

A technology of integrated circuits and testing devices, applied in the field of high and low temperature testing devices for integrated circuits, to achieve the effect of saving high and low temperature testing time

Inactive Publication Date: 2018-06-12
NINGBO XINLU COMM TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Existing high and low temperature testing methods all use high and low temperature chambers to simulate the temperature stress of integrated circuits under different working conditions. Existing high and low temperature testing devices and methods cannot test multiple or even large Batches of integrated circuits for high and low temperature testing

Method used

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  • High and low temperature test device of integrated circuit
  • High and low temperature test device of integrated circuit
  • High and low temperature test device of integrated circuit

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Embodiment Construction

[0045] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0046] It should be noted that the embodiments of the present invention and the features in the embodiments can be combined with each other if there is no conflict.

[0047] The present invention will be further described below with reference to the drawings and specific embodiments, but it is not a limitation of the present invention.

[0048] Such as figure 1 As shown, this embodiment includes:

[0049] An integrated circuit fixing device 3...

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PUM

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Abstract

The invention discloses a high and low temperature test device of an integrated circuit, and belongs to the technical field of circuit test. The test device comprises an integrated circuit fixing device and an integrated circuit test system, the integrated circuit fixing device is arranged in a high and low temperature casing, the integrated circuit test system connected with the integrated circuit fixing device so that the integrated circuit fixing device is controlled to send a test chip in and out and temperature stress test is carried out on the test chip, and the integrated circuit fixingdevice comprises a charging mechanism, a test mechanism, a sorting mechanism and a discharging mechanism. The high and low temperature test device of the integrated circuit has the advantages that batch of integrated circuit chips can be tested needless of opening the high and low temperature casing when the test chips are tested, high and low temperature test time of IC is reduced greatly, and high and low temperature electrical performance of the multiple and even batch of IC can be tested under the condition that the high and low temperature casing is not opened.

Description

Technical field [0001] The invention relates to a technology in the field of circuit testing, in particular to a high and low temperature testing device for integrated circuits. Background technique [0002] With the development of microelectronics technology, integrated circuit (IC) products are becoming more abundant, and the requirements for the functions and performance of integrated circuits are getting higher and higher. The high and low temperature environment has a great influence on the function and performance of the integrated circuit. Therefore, the high and low temperature test is one of the indispensable test items in the integrated circuit test. [0003] Existing high and low temperature test methods all use high and low temperature boxes to simulate the temperature stress of integrated circuits under different working conditions. The existing high and low temperature test devices and methods cannot test multiple or even large numbers without opening the high and low...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28
Inventor 秦岭尹子建周海峰
Owner NINGBO XINLU COMM TECH CO LTD
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