Array substrate and preparation method thereof

Abstract

The invention provides an array substrate and a preparation method thereof. The array substrate comprises a substrate body, a metal layer formed on the substrate body, a passivation layer formed on the substrate body and the metal layer, a flat layer formed on the passivation layer, a contact hole formed by etching the flat layer and the passivation layer on the metal layer, and a continuous pixelelectrode layer formed on the flat layer and the contact hole and connected with the metal layer, wherein the metal layer is at least partially exposed to the contact hole, and the hole wall, on thepassivation layer, of the contact hole and the hole wall, on the flat layer, of the contact hole are located on the same plane or form an obtuse angle. By performing two-step etching on the flat layerand the passivation layer on the metal layer, the hole wall, on the passivation layer, of the contact hole and the hole wall, on the flat layer, of the contact hole are located on the same plane or form an obtuse angle, and the problem that in the prior art, a pixel electrode layer fractures due to undercutting is solved.

Description

technical field [0001] The present invention relates to the technical field of screen display, in particular to an array substrate and a preparation method thereof. Background technique [0002] With the manufacturing process of the array substrate (Array) segment of the LCD panel, more and more applications of COA (color filter layer integrated into the array substrate, Color filter on Array), POA (photoresist spacer integrated into the array substrate, Photo spacer on Array) New technologies such as PFA (polymer film on array) technology need to be introduced to prepare a flat layer and optimize the surface flatness of the film layer. [0003] Please refer to figure 1 As shown, the usual manufacturing process of the array substrate is: first deposit and form the metal layer 11' on the base substrate 1', then form the passivation layer 12' on the base substrate 1' and the metal layer 11', and then passivate A flat layer 13′ is formed on the layer 12′, and the flat layer 1...

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Problems solved by technology

[0004] Next, when depositing the pixel electrode layer 14´, refer to figure 2 As shown, since an undercut 10′ is formed between the edge of the flat layer 13′ and the edge of the passivation layer 12′, the pixel electrode layer 14′ at this location is prone to breakage

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