Embedded board mounting method

A built-in, mounting board technology, applied in the direction of rigid containers, containers, packaging, etc., can solve the problems of unsightly appearance and easy falling off of products, achieve good economic and social benefits, beautiful appearance, and prevent product damage and falling off Effect

Pending Publication Date: 2018-06-15
上海浅月印刷包装有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, it is generally used to die-cut holes of the same size on the gray board or directly glue the product to the inner side of the cardboard. There are technical defects that the product is easy to fall off and the overall appearance is not beautiful due to the leakage of the product installation.

Method used

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Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0010] The present invention will be further described below, but not as limitation of the present invention:

[0011] A method for embedded mounting boards, comprising the following steps:

[0012] A) Use cardboard with the same thickness as the product, and die-cut the shape of the product on the cardboard;

[0013] B), embedding the product into the cardboard;

[0014] C) Die-cut two perforated cardboards that are 3-5 mm smaller than the outer edge of the product;

[0015] D) Adhere a die-cut hole-shaped cardboard on both sides of the cardboard to seal the product firmly in the middle to achieve the effect of fixing and protecting the product, reducing the damage rate of the product, not easy to fall off, and beautiful in appearance.

[0016] Above-mentioned embodiment of the present invention, only clearly illustrates the example that the present invention does, but is not used to limit protection scope of the present invention, all equivalent technical schemes also belo...

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PUM

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Abstract

An embedded board mounting method comprises the following steps that A), a paperboard with the same thickness as a product is adopted, and the paperboard is die-cut into the shape matched with the product; B), the product is embedded into the paperboard; C), two hole-shaped paperboards with the size 3-5 mm smaller than that of the outer edge of the product are die-cut; D), the die-cut hole-shapedpaperboards are correspondingly adhered on the two sides of the paperboard, the product is firmly sealed between the die-cut hole-shaped paperboards, the effects of fixing and protecting the product are achieved, the damage rate of the product is lowered, and the product is not likely to fall and is attractive in appearance. By the adoption of the embedded board mounting method, the process operation is simple, the completely embedded method of the product is adopted, the product is effectively protected, the product is prevented from being damaged and falling off, and meanwhile the attractiveappearance of the entire package is achieved. The embedded board mounting method bas good economic and social benefits in application and popularization.

Description

technical field [0001] The invention belongs to the technical field of packaging box cardboard, and in particular relates to a method for an embedded mounting board, which is suitable for the installation of packaging boxes or cardboard book products. Background technique [0002] At present, it is generally used to die-cut holes of the same size on the gray board or directly glue the product on the inner side of the cardboard. There are technical defects that the product is easy to fall off and the overall appearance is not beautiful due to the leakage of the product installation. Contents of the invention [0003] The object of the present invention is to solve the above-mentioned technical problems. [0004] The object of the present invention is achieved like this: a kind of method for built-in mounting board, it is characterized in that: comprise the following operation steps: [0005] A) Use cardboard with the same thickness as the product, and die-cut the shape of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65D5/50
CPCB65D5/5059
Inventor 程志宝黎俊鹰蔡辉
Owner 上海浅月印刷包装有限公司
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