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Mask plate and mask plate preparation method

A mask and etching zone technology, applied in metal material coating process, vacuum evaporation coating, coating and other directions, can solve problems such as mask or product damage, prevent damage and improve evaporation yield Effect

Active Publication Date: 2020-05-26
KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of this, the embodiments of the present invention are dedicated to providing a mask and a mask preparation method to solve the problem that the evaporation particles generated during the evaporation process can easily cause damage to the mask or products

Method used

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  • Mask plate and mask plate preparation method
  • Mask plate and mask plate preparation method
  • Mask plate and mask plate preparation method

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Embodiment Construction

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0023] figure 1 Shown is a schematic structural diagram of the mask plate provided by the first embodiment of the present invention. Such as figure 1 As shown, the mask plate 1 provided by the first embodiment of the present invention includes several rectangular opening units 11 opened on the mask plate base material and several elongated non-etching regions 12 arranged parallel to each other adjacent to the opening units 11. At the same time, ...

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Abstract

The embodiment of the invention provides a mask plate and a production method thereof. Fully-etched areas comprise a plurality of opening units, wherein a semi-etched area is arranged around each opening unit. According to the mask plate, through a manner of setting semi-etched areas around the opening units, evaporation residual particles adhered to a glass substrate fall into the range of the semi-etched areas of the mask plate in the transmission process of the glass substrate, so that the occurrence of the situation that the mask plate or the evaporation product is damaged by the residualparticles in the evaporation process is effectively avoided; and the evaporation yield is effectively improved.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a mask and a method for preparing the mask. Background technique [0002] During the evaporation process of the glass substrate of the display device, the evaporation particles are likely to remain on the glass substrate that is not cleaned cleanly, and the remaining particles on the glass substrate and the remaining particles on the glass substrate transmission channel are easily brought in by the transmission of the glass substrate. Different evaporation chambers (including general metal mask chambers and precision metal mask chambers, etc.), thus causing damage to the mask. [0003] Especially when the particles are brought into the cavity of the precision metal mask, the particles brought into the cavity of the precision metal mask can easily cause dents on the mesh surface of the precision metal mask, which directly causes the product to appear fixed. Irreversible damage s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/04C23C14/24
CPCC23C14/042C23C14/24
Inventor 欧凌涛甘帅燕卓林海
Owner KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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