Method and device for transporting wafer

Abstract

The invention relates to the field of single wafer cleaning equipment, in particular to a method and device for transporting a wafer. According to the method, the wafer is grabbed through a grab structure; the wafer is transported to a preset position; the wafer is clamped out from the grab structure through a turnover structure and the angle of the wafer is adjusted, so that the angle of the wafer is consistent with that of a process groove; and the wafer is put into the process groove through the turnover structure, so that transportation of the wafer in the process grooves of different directions and angles is achieved. According to the method, the wafer transporting capacity is high.

Description

Technical field [0001] The invention relates to the field of single wafer cleaning equipment, and in particular to a method and device for transferring wafers. Background technique [0002] Wafer cleaning equipment is composed of multiple process tanks, and each tank is responsible for a cleaning process, such as ultrasonic / megasonic cleaning tank, scrubbing tank, drying tank, etc. In order to achieve the established process effect, the setting directions and angles of each tank are different, for example, there are horizontal installations and vertical installations. Each wafer processing process may pass through these directions and angles. The processing of the same process slot. However, placing the wafer in the process slot in different directions has become a technical problem. [0003] The existing wafer transfer device clamps the wafer through the opening and closing of the pickup arm and the gripper. The opening and closing of the gripper is realized by the cylinder conn...

AI Technical Summary

Problems solved by technology

However, the transfer throughput of existing wafer transfer devices and wafer transfer methods is low

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