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Method of electrostatically adsorbing substrates

An electrostatic adsorption and electrostatic chuck technology, which is applied in the manufacture of circuits, electrical components, semiconductor/solid-state devices, etc., can solve the problem of poor electrostatic adsorption effect of the substrate, and achieve the effect of avoiding the substrate falling off, improving the adsorption effect, and avoiding production loss.

Active Publication Date: 2020-06-16
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In order to solve the above-mentioned problem of poor electrostatic adsorption effect of the electrostatic chuck on the substrate, the present invention provides a method for electrostatically adsorbing the substrate

Method used

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  • Method of electrostatically adsorbing substrates
  • Method of electrostatically adsorbing substrates
  • Method of electrostatically adsorbing substrates

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Embodiment Construction

[0026] A method for electrostatically adsorbing a substrate proposed by the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. The advantages and features of the present invention will become clearer from the following description. It should be noted that all the drawings are in a very simplified form and use imprecise scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.

[0027] figure 1 is a schematic flow diagram of a method for electrostatically adsorbing a substrate in an embodiment of the present invention; Figure 3 ~ Figure 7 It is a schematic structural diagram of the preparation process of the film layer in the method for electrostatically adsorbing the substrate in an embodiment of the present invention, and the following reference figure 1 and Figure 3 ~ Figure 7 As shown, the specific implementation steps ...

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Abstract

The invention provides a substrate electrostatic adsorption method. The substrate electrostatic adsorption method has the advantages that a film layer doped with conductive particles is formed at theback surface of a substrate; an electrostatic chuck is used for adsorbing the substrate from the back surface of the substrate; because the electrostatic chuck has larger electrostatic adsorption force on the film layer doped with the conductive particles, the electrostatic chuck has better adsorption effect on the substrate, thereby avoiding the falling of the substrate from the electrostatic chuck due to poor electrostatic adsorption effect of the electrostatic chuck on the substrate, and avoiding the unnecessary production loss.

Description

technical field [0001] The invention relates to the field of semiconductor preparation, in particular to a method for electrostatically adsorbing a substrate. Background technique [0002] In the semiconductor manufacturing process, various machines usually need to use electrostatic chucks to absorb the substrate. Specifically, there are multiple positive and negative electrode pairs in the electrostatic chuck. By connecting each electrode to a high-voltage DC power supply, polarized charges are generated on the surface of the electrostatic chuck in contact with the substrate, and the polarized charges form an electric field on the surface of the electrostatic chuck. Polarized charges are generated on the back of the substrate in contact with it, and the corresponding free charges are also gathered to the back by the electric field. Under the action of electrostatic attraction generated by opposite charges, the substrate is firmly adsorbed and fixed on the substrate. on the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/683H01L21/02
CPCH01L21/02697H01L21/6831
Inventor 蒙飞
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP