Touch sensing module and production method thereof and touch display panel provided with touch sensing module
A touch sensing and module technology, which is applied in the input/output process of data processing, instruments, electrical and digital data processing, etc., can solve the problems of complex process, and achieve the effect of simplifying the process, saving costs, and good visual effects.
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[0027] First embodiment
[0028] Such as Figure 1 to Figure 3 As shown, the touch sensing module 10 of the first embodiment of the present invention includes a substrate 11, a first same-layer structure 12, a second same-layer structure 15, wires 16, an insulating layer 14 and vias 13.
[0029] The substrate 11 is the supporting base of the touch sensing module 10, and the first same layer structure 12, the second same layer structure 15, the wire 16, the insulating layer 14 and the conductive layer of the touch sensor module 10 The through hole 13 is provided on the substrate 11. The substrate 11 may be a flexible material or a non-flexible material. In this embodiment, the substrate 11 is a flexible material, which has flexibility, so that the touch sensing module 10 can be applied to a curved display device or a flexible display. Device. The material of the substrate 11 may be organic, such as polycarbonate (PC), polyimide (PI), polyethylene naphthalate two formic acid glycol...
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[0042] Second embodiment
[0043] See Figure 4a to 4g , Are schematic diagrams of the steps of the manufacturing method of the touch sensing module provided by the specific embodiments of the present invention. It should be noted that the manufacturing method of the touch sensing module of the present invention is not limited to the sequence of the following steps, and in other embodiments, the manufacturing method of the touch sensing module of this embodiment may only include the following Part of the steps, or part of the steps, can be deleted.
[0044] Combine below Figure 4a to 4g The manufacturing method of the touch sensing module provided by the specific embodiment of the present invention is introduced in detail.
[0045] The manufacturing method of the touch sensing module 10 of the preferred embodiment of the present invention includes the following steps:
[0046] Step 1: Provide a substrate. A first conductive material layer A that does not transmit light is formed by ...
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