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Ultrasonic device and ultrasonic apparatus

An ultrasonic and device technology, applied in the field of ultrasonic devices and ultrasonic devices, can solve problems such as obstruction of piezoelectric bodies, deformation of vibration parts, reduction of transmission and reception sensitivity, reduction of ultrasonic transmission sensitivity and reception sensitivity, etc., to achieve high-precision ultrasonic measurement and improve transmission and reception sensitivity. Effect

Active Publication Date: 2018-07-03
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the rigidity of these insulating films and conductive wiring, the deformation of the piezoelectric body and the vibrating part may be hindered, and the transmission and reception sensitivity of ultrasonic waves may decrease, that is, the transmission and reception sensitivity may decrease.

Method used

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  • Ultrasonic device and ultrasonic apparatus
  • Ultrasonic device and ultrasonic apparatus
  • Ultrasonic device and ultrasonic apparatus

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0055] Next, the ultrasonic measurement device according to the first embodiment will be described based on the drawings.

[0056] figure 1 It is a perspective view showing a schematic configuration of the ultrasonic measuring device 1 .

[0057] like figure 1 As shown, the ultrasonic measuring device 1 includes: an ultrasonic probe 2 ; and a control device 10 electrically connected to the ultrasonic probe 2 via a cable 3 .

[0058] This ultrasonic measurement device 1 brings an ultrasonic probe 2 into contact with the surface of a living body (for example, a human body), and transmits ultrasonic waves from the ultrasonic probe 2 into the living body. Ultrasonic waves reflected by organs in the living body are received by the ultrasonic probe 2, and based on the received signals, for example, internal tomographic images in the living body are obtained and states of organs in the living body (eg, blood circulation, etc.) are measured.

[0059] [Configuration of the control d...

no. 2 approach

[0141] Next, a second embodiment will be described.

[0142] In the ultrasonic device of the first embodiment, a plurality of ultrasonic transducers 45 constituting the ultrasonic transducer unit 450 are connected in parallel. On the other hand, the second embodiment is different in that some of the plurality of ultrasonic transducers are connected in series.

[0143] In addition, in the following description, the same code|symbol is attached|subjected to the same structure as 1st Embodiment, and the description is abbreviate|omitted or simplified.

[0144] [Structure of Ultrasonic Device]

[0145] Figure 9 It is a diagram schematically showing the element substrate 41 constituting the ultrasonic device 22A when viewed from the sealing plate 42 side. in addition, Figure 10 is schematically shown along the Figure 9 A cross-sectional view of a cross-section of the ultrasonic device 22A taken along line E-E' is shown. in addition, Figure 11 is schematically shown along...

no. 3 approach

[0189] Next, a third embodiment will be described.

[0190] In the ultrasonic devices according to the first embodiment and the second embodiment, the lead-out portion, which is smaller in width than the active portion of the piezoelectric film and has a substantially rectangular shape in plan view, is led out from the active portion. On the other hand, the third embodiment differs from the first and second embodiments in that the lead-out portion has a connecting portion whose width dimension increases toward the active portion.

[0191] In addition, in the following description, the same code|symbol is attached|subjected to the same structure as 1st Embodiment, and the description is abbreviate|omitted or simplified.

[0192] Figure 14 It is a top view schematically showing the ultrasonic transducer 49 of the third embodiment.

[0193] In the ultrasonic transducer 49 , the lead-out portion 62 has a connection portion 624 connected to the active portion 61 .

[0194] In a...

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PUM

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Abstract

The invention relates to an ultrasonic device and an ultrasonic apparatus. The ultrasonic device includes a vibration portion, a first electrode, a piezoelectric body, and a second electrode which arelaminated in this order in a laminate direction, in which an outer circumferential edge of the first electrode is larger than an outer circumferential edge of the piezoelectric body in a plan view across the laminate direction, in which the piezoelectric body includes an active portion that is provided in the vibration portion, and an extraction portion that is connected to the active portion andis provided over the inside and the outside of the vibration portion, in which a width dimension of the extraction portion is smaller than a width dimension of the active portion, and in which the second electrode is provided on the active portion and the extraction portion.

Description

technical field [0001] The present invention relates to an ultrasonic device and an ultrasonic device. Background technique [0002] Conventionally, there is known an ultrasonic sensor (ultrasonic device) comprising: a substrate on which a plurality of openings are formed; a vibrating plate provided on the substrate so as to close each opening; A region where the openings overlap (vibration portion) (for example, refer to Patent Document 1). [0003] The piezoelectric element is formed by laminating a first electrode, a piezoelectric body, and a second electrode in this order from the vibrating portion side. The ultrasonic device is driven by applying a voltage between the first electrode and the second electrode, and transmits ultrasonic waves. In addition, when receiving ultrasonic waves, the ultrasonic device outputs a change in the potential difference between the first electrode and the second electrode as an ultrasonic wave reception signal. [0004] Here, in the pi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R17/00A61B8/00H01L41/047H01L41/08
CPCA61B8/44A61B8/4483H04R17/00H10N30/87H10N30/704B06B1/0622B06B1/0644B06B1/0207H10N30/875H10N30/2047H10N30/871H10N30/302H10N30/706
Inventor 小岛力大桥幸司岩井光清濑摄内
Owner SEIKO EPSON CORP
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