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Ultrasonic devices and ultrasonic devices

An ultrasonic and device technology, applied in the field of ultrasonic devices and ultrasonic devices, can solve the problems of reduced transmission and reception sensitivity, reduced ultrasonic transmission sensitivity, reduced receiving sensitivity, obstruction of piezoelectric bodies, deformation of vibration parts, etc.

Active Publication Date: 2021-10-12
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the rigidity of these insulating films and conductive wiring, the deformation of the piezoelectric body and the vibrating part may be hindered, and the transmission and reception sensitivity of ultrasonic waves may decrease, that is, the transmission and reception sensitivity may decrease.

Method used

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  • Ultrasonic devices and ultrasonic devices
  • Ultrasonic devices and ultrasonic devices
  • Ultrasonic devices and ultrasonic devices

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0055] Next, the ultrasonic measurement device according to the first embodiment will be described based on the drawings.

[0056] figure 1 It is a perspective view showing a schematic configuration of the ultrasonic measuring device 1 .

[0057] Such as figure 1 As shown, the ultrasonic measuring device 1 includes: an ultrasonic probe 2 ; and a control device 10 electrically connected to the ultrasonic probe 2 via a cable 3 .

[0058] This ultrasonic measurement device 1 brings an ultrasonic probe 2 into contact with the surface of a living body (for example, a human body), and transmits ultrasonic waves from the ultrasonic probe 2 into the living body. Ultrasonic waves reflected by organs in the living body are received by the ultrasonic probe 2, and based on the received signals, for example, internal tomographic images in the living body are obtained and states of organs in the living body (eg, blood circulation, etc.) are measured.

[0059] [Configuration of the contro...

no. 2 approach

[0141] Next, a second embodiment will be described.

[0142] In the ultrasonic device of the first embodiment, a plurality of ultrasonic transducers 45 constituting the ultrasonic transducer unit 450 are connected in parallel. On the other hand, the second embodiment is different in that some of the plurality of ultrasonic transducers are connected in series.

[0143] In addition, in the following description, the same code|symbol is attached|subjected to the same structure as 1st Embodiment, and the description is abbreviate|omitted or simplified.

[0144] [Structure of Ultrasonic Device]

[0145] Figure 9 It is a diagram schematically showing the element substrate 41 constituting the ultrasonic device 22A when viewed from the sealing plate 42 side. in addition, Figure 10 is schematically shown along the Figure 9 A cross-sectional view of a cross-section of the ultrasonic device 22A taken along line E-E' is shown. in addition, Figure 11 is schematically shown along...

no. 3 approach

[0189] Next, a third embodiment will be described.

[0190] In the ultrasonic devices according to the first embodiment and the second embodiment, the lead-out portion, which is smaller in width than the active portion of the piezoelectric film and has a substantially rectangular shape in plan view, is led out from the active portion. On the other hand, the third embodiment differs from the first and second embodiments in that the lead-out portion has a connecting portion whose width dimension increases toward the active portion.

[0191] In addition, in the following description, the same code|symbol is attached|subjected to the same structure as 1st Embodiment, and the description is abbreviate|omitted or simplified.

[0192] Figure 14 It is a top view schematically showing the ultrasonic transducer 49 of the third embodiment.

[0193] In the ultrasonic transducer 49 , the lead-out portion 62 has a connection portion 624 connected to the active portion 61 .

[0194] In a...

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PUM

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Abstract

The present invention relates to an ultrasonic device and an ultrasonic device. A vibrating part, a first electrode, a piezoelectric body, and a second electrode are sequentially stacked along the sequential stacking direction. When viewed from the stacking direction, the outer peripheral edge of the first electrode is more than The outer periphery of the piezoelectric body is large, and the piezoelectric body has: an active part, which is arranged in the vibrating part; The size is small, and the second electrode is arranged on the active part and the lead-out part.

Description

technical field [0001] The present invention relates to an ultrasonic device and an ultrasonic device. Background technique [0002] Conventionally, there is known an ultrasonic sensor (ultrasonic device) comprising: a substrate on which a plurality of openings are formed; a vibrating plate provided on the substrate so as to close each opening; A region where the openings overlap (vibration portion) (for example, refer to Patent Document 1). [0003] The piezoelectric element is formed by laminating a first electrode, a piezoelectric body, and a second electrode in this order from the vibrating portion side. The ultrasonic device is driven by applying a voltage between the first electrode and the second electrode, and transmits ultrasonic waves. In addition, when receiving ultrasonic waves, the ultrasonic device outputs a change in the potential difference between the first electrode and the second electrode as an ultrasonic wave reception signal. [0004] Here, in the pi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): A61B8/00H04R17/00H01L41/047H01L41/08H10N30/87H10N30/00H10N30/20H10N30/30
CPCA61B8/44A61B8/4483H04R17/00H10N30/87H10N30/704B06B1/0622B06B1/0644B06B1/0207H10N30/875H10N30/2047H10N30/871H10N30/302H10N30/706
Inventor 小岛力大桥幸司岩井光清濑摄内
Owner SEIKO EPSON CORP
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