3D stacked infrared image sensor
An infrared image and sensor technology, applied in the field of 3D stacked infrared image sensor, can solve the problems of inconvenient application, large product volume, large volume, etc., and achieve the effect of convenient application, improved usability and performance
Inactive Publication Date: 2018-07-06
上海微阱电子科技有限公司
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Problems solved by technology
However, the infrared image sensing products currently on the market are generally large in size and single in function.
Infrared image sensor chips generally only have analog signal output, and also need to perform analog-to-digital conversion and digital processing arrays outside the chip, which leads to large size of related products and inconvenient application
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[0018] The specific embodiment of the present invention will be further described in detail below in conjunction with the accompanying drawings.
[0019] It should be noted that, in the following specific embodiments, when describing the embodiments of the present invention in detail, in order to clearly show the structure of the present invention for the convenience of description, the structures in the drawings are not drawn according to the general scale, and are drawn Partial magnification, deformation and simplification are included, therefore, it should be avoided to be interpreted as a limitation of the present invention.
[0020] In the following specific embodiments of the present invention, please refer to figure 1 , figure 1 It is a schematic cross-sectional view of a structure of a 3D stacked infrared image sensor according to a preferred embodiment of the present invention. Such as figure 1 As shown, a 3D stacked infrared image sensor structure of the present i...
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The invention discloses a 3D stacked infrared image sensor comprising: a first chip, a second chip and a third chip, which are stacked up and down in sequence, wherein an infrared photosensitive arrayis arranged on the first chip, a pixel processing unit array is arranged on the second chip, an analog-digital conversion and digital processing array is arranged on the third chip, and the infraredphotosensitive array, the pixel processing unit array and the analog-digital conversion and digital processing array are connected with each other through metal connecting columns arranged among the first chip, the second chip and the third chip. The 3D stacked infrared image sensor disclosed by the invention has the advantages of high-speed output, high integration of the chips and convenient application, can effectively improve the usability and the performance of the chips, and is suitable for popularization and use.
Description
technical field [0001] The present invention relates to the field of infrared image sensors, and more particularly, to a 3D stacked infrared image sensor. Background technique [0002] Infrared image sensors have been widely used in military, medical, security, industrial and other fields by virtue of their night vision and temperature measurement functions. However, the infrared image sensing products currently on the market are generally large in size and single in function. Infrared image sensor chips generally only have analog signal output, and analog-to-digital conversion and digital processing arrays need to be performed outside the chip, which leads to relatively large size and inconvenient application. [0003] With the development of semiconductor technology, CMOS image sensor (CIS) chips are developing towards high resolution and high performance. The three-dimensional (3D) stacking technology of chips is becoming more and more mature, and more and more CIS desig...
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IPC IPC(8): H04N5/374H04N5/3745H04N5/33
CPCH04N5/33H04N25/76H04N25/77
Inventor 段杰斌温建新
Owner 上海微阱电子科技有限公司