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High-speed memory chip structure layout method based on uniform and continuous heat flow distribution

A memory chip and structural layout technology, applied in special data processing applications, instruments, electrical digital data processing, etc., can solve problems such as visual heat flow paths, and achieve the effect of improving heat dissipation performance

Inactive Publication Date: 2018-07-10
XI AN JIAOTONG UNIV
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Problems solved by technology

However, there are few methods available on how to describe and quantify heat flow trajectories and efficiencies of cooling structures, nor is there a generally accepted method for visualizing heat flow paths

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  • High-speed memory chip structure layout method based on uniform and continuous heat flow distribution
  • High-speed memory chip structure layout method based on uniform and continuous heat flow distribution
  • High-speed memory chip structure layout method based on uniform and continuous heat flow distribution

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Embodiment Construction

[0053] The design method proposed by the present invention can optimize the layout design of high thermal conductivity materials on various heat dissipation structures. The present invention will be described in detail below with reference to the accompanying drawings and embodiments.

[0054] refer to figure 1 , a high-speed memory chip structure layout design method based on uniform and continuous distribution of heat flow, comprising the following steps:

[0055] 1) C to build a heat dissipation structure * field:

[0056] 1.1) Given load and boundary conditions: such as figure 2 As shown, the heat dissipation structure is a rectangular area of ​​100mmX20mm, and a heat sink and a heat source point are respectively arranged at the midpoints of the two short sides of the rectangle, and the temperature of the heat sink is T 0 = 0°C, the heat flow q" of the heat source = 10W; in this embodiment, the thermal conductivity of the high thermal conductivity material and the ther...

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Abstract

The invention relates to a high-speed memory chip structure layout method based on uniform and continuous heat flow distribution. The method comprises the following steps: firstly, quantitatively describing the function of each point on a heat dissipation structure in heat transfer and balance, and constructing a C* field; secondly, visualizing a heat flow path of the heat dissipation structure with a section analysis method, and analyzing uniformity and continuity features of the heat flow path based on the heat flow path of the visualization structure; establishing a mathematical optimization model designed for the heat dissipation structure with a classical SIMP method and forming a heat dissipation structure layout design method based on uniform and continuous heat flow distribution. Contribution of different points in heat dissipation can be known visually by heat flow path analysis, and a scientific heat dissipation structure design scheme matched with the structural heat load boundary is obtained.

Description

technical field [0001] The invention relates to the technical field of high-speed chip structure layout design, in particular to a layout design method of a high-speed memory chip heat dissipation structure based on uniform and continuous heat flow distribution. technical background [0002] The field of optoelectronics is the most important field for the development of human science and technology and the continuous progress of society in the 21st century, with microelectronics and intelligent technology as the core. With the rapid development of the field of optoelectronics, the ultra-high-performance high-speed memory chip technology has made great progress, but the corresponding heat dissipation technology is far behind the development speed of high-speed memory chips, and the heat dissipation problem is becoming more and more serious. Due to the massive accumulation of heat, the performance of electronic devices and chips will be degraded, and may even be damaged. Alth...

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Application Information

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IPC IPC(8): G06F17/50
CPCG06F30/23G06F30/392
Inventor 李宝童洪军刘國光唐文豪陈豪
Owner XI AN JIAOTONG UNIV
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