Packaging structure of remote sensor and packaging method thereof

A technology of packaging structure and packaging method, which is applied in the fields of electric solid-state devices, semiconductor devices, semiconductor/solid-state device manufacturing, etc., and can solve the problems of short sensing distance of long-distance sensors and reduced sensing accuracy of chips

Active Publication Date: 2018-07-10
LINGSEN PRECISION INDS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] But, this kind utilizes the mode of molding process to form this cover, because molding mold can't be close to each this lens part, so the inner wall surface of this light emitting hole and this light receiving hole usually can be spaced apart from each this lens part by a distance, makes far The sensing distance of the distance sensor is relatively short, and there will be more external light noise entering, which will reduce the sensing accuracy of the chip. Therefore, the commonly used long-distance sensor packaging structure and its packaging method still have their shortcomings, which need to be improved.

Method used

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  • Packaging structure of remote sensor and packaging method thereof
  • Packaging structure of remote sensor and packaging method thereof
  • Packaging structure of remote sensor and packaging method thereof

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Embodiment Construction

[0035] Please refer to attached image Figure 1~2 The package structure 10 of the remote sensor provided by the first preferred embodiment of the present invention includes a substrate 20, a light-emitting chip 30, a sensing chip 40, two encapsulants 50, a cover 60 and two shielding means 70.

[0036] The substrate 20 has a bearing surface 22, and the substrate 20 can be a printed circuit board (commonly known as PCB), a bismaleimide triazine substrate (commonly known as BT), a glass fiber substrate (commonly known as FR4) or a direct copper clad substrate (commonly known as DBC). ) but not limited thereto, whereby the production cost of the substrate 20 is lower.

[0037] The light-emitting chip 30 is disposed on the carrying surface 22 and electrically connected to the substrate 20 through a wire bonding process. In this preferred embodiment, the light-emitting chip 30 is an LED chip and can be used to emit light.

[0038] The sensing chip 40 is disposed on the carrying su...

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Abstract

A packaging structure of a remote sensor includes a substrate, a light-emitting chip, a sensing chip, two packaging glue bodies, a packaging cover, and two shielding means. The substrate has a bearingsurface. The light-emitting chip is arranged on the bearing surface. The sensing chip is arranged on the bearing surface and is separated from the light-emitting chip. The two packaging glue bodies coat the light-emitting chip and the sensing chip respectively. The top surface of each packaging glue body forms a lens portion and a shoulder portion. The packaging cover is formed over the bearing surface and the packaging glue bodies. The packaging cover is provided with a light emission hole and a light reception hole, which are used for accommodating the lens portion and the shoulder portionon the top surface of one packaging glue body and the lens portion and the shoulder portion on the top surface of the other packaging glue body respectively. The two shielding means are arranged on the two shoulder portions respectively and are used for preventing light from passing by the shoulder portions.

Description

technical field [0001] The present invention relates to a packaging structure, in particular to a packaging structure of a remote sensor and a packaging method thereof. Background technique [0002] The known long-distance sensor packaging structure is to arrange a light-emitting chip and a sensing chip on a substrate, and then cover the light-emitting chip and the sensing chip with two encapsulants through a molding process (Molding). A hemispherical lens is formed on the top surface of the encapsulant to correspond to the light-emitting chip and the sensing chip. Finally, a cover is placed on the substrate and each of the encapsulants through a molding process to complete the entire packaging process. It is worth mentioning that , the cover usually defines a light-emitting hole and a light-receiving hole for accommodating each of the lens parts respectively. [0003] But, this kind utilizes the mode of molding process to form this cover, because molding mold can't be clos...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/16H01L23/31H01L21/50
CPCH01L21/50H01L23/3121H01L25/167H01L2224/48091H01L2224/48227H01L2924/00014
Inventor 林静邑杜明德
Owner LINGSEN PRECISION INDS
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