High-lumen maintenance organosilicon material for LED packaging

A technology of LED packaging and silicone, applied in polymer adhesive additives, non-polymer adhesive additives, adhesive additives, etc., can solve the problems of yellowing, low luminous flux, and the packaging materials are not resistant to alternating heat and cold. , to achieve the effect of no yellowing, high luminous flux, and favorable luminous efficiency

Active Publication Date: 2018-07-20
NINGBO KLITE ELECTRIC MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the problem that the packaging material in the prior art is not resistant to alternating cold and heat, there may be a possibility of yellowing, and the luminous flux is low, and to provide a packaging material that can withstand alternating cold and heat in the environment, does not yellow, and has high luminous flux. A kind of organosilicon material for LED packaging with high lumen maintenance rate

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] A silicone material for LED packaging with a high lumen maintenance rate, the silicone material includes silicone A component, silicone B component, nano-magnesium oxide, fluorescent powder and acrylic polymer;

[0031] The composition of the organosilica gel A component is as follows: 60 parts of polymethylphenylsiloxane with vinyl end groups, 5 parts of polydimethylsiloxane with vinyl end groups, active organic borosilicate viscosity-increasing 3 parts of agent, 10 parts of vinyl-terminated hyperbranched silicone resin and 0.05 part of platinum catalyst;

[0032] The composition of the silicone B component is as follows: 35 parts of polymethylphenylvinylsiloxane with vinyl end groups, 45 parts of polymethylhydrogensiloxane, 5 parts of MQ resin, silane coupling agent A -172 3 copies;

[0033] In the organic silicon material, the mass-number ratio of component A of silicone, component B of silicone, nano-magnesia, fluorescent powder and acrylic polymer is 100:100:2.5:3...

Embodiment 2

[0037]A kind of organic silicon material for LED encapsulation with high lumen maintenance rate, described organic silicon material comprises organic silica gel A component, organic silica gel B component, cetyl polysilsesquioxane, nano magnesium oxide, fluorescent powder and Acrylic polymer;

[0038] The composition of the organosilica gel A component is as follows: 85 parts of polymethylphenylsiloxane with vinyl end groups, 15 parts of polydimethylsiloxane with vinyl end groups, active organic borosilicate 8 parts of agent, 25 parts of vinyl-terminated hyperbranched silicone resin and 0.5 part of platinum catalyst;

[0039] The composition of the silicone B component is as follows: 45 parts of polymethylphenyl vinyl siloxane with vinyl end groups, 55 parts of polymethyl hydrogen siloxane, 15 parts of MQ resin, silane coupling agent A -172 8 copies;

[0040] In the organic silicon material, the mass-number ratio of the organosilica A component, the organosilica B component,...

Embodiment 3

[0044] A kind of organic silicon material for LED encapsulation with high lumen maintenance rate, described organic silicon material comprises organic silica gel A component, organic silica gel B component, cetyl polysilsesquioxane, nano magnesium oxide, fluorescent powder and Acrylic polymer;

[0045] The composition of the organosilica gel A component is as follows: 75 parts of polymethylphenylsiloxane with vinyl end groups, 8 parts of polydimethylsiloxane with vinyl end groups, active organic borosilicate tackifier 5 parts of agent, 18 parts of vinyl-terminated hyperbranched silicone resin and 0.2 parts of platinum catalyst;

[0046] The composition of the silicone B component is as follows: 40 parts of polymethylphenylvinylsiloxane with vinyl end groups, 50 parts of polymethylhydrogensiloxane, 8 parts of MQ resin, silane coupling agent A -172 5 copies;

[0047] In the organic silicon material, the mass-number ratio of the organosilica A component, the organosilica B comp...

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Abstract

The invention discloses a high-lumen maintenance organosilicon material for LED packaging. The organosilicon material comprises a silicone component A, a silicone component B, nanometer magnesium oxide, a phosphor and an acrylic polymer, wherein the silicone component A comprises 60-85 parts of vinyl-terminated polymethylphenylsiloxane, 5-15 parts of vinyl-terminated polydimethylsiloxane, 3-8 parts of an active organic borosilicate tackifier, 10-25 parts of vinyl-terminated hyperbranched silicone resin and 0.05-0.5 part of a platinum catalyst; the silicone component B comprises 35-45 parts ofvinyl-terminated polymethylphenylvinylsiloxane, 45-55 parts of polymethylhydrosiloxane, 5-15 parts of MQ resin and 3-8 parts of a silane coupling agent A-172; and a mass part ratio of the silicone component A to the silicone component B to the nanometer magnesium oxide to the phosphor to the acrylic polymer in the organosilicon material is 100:100:(2.5-18):(3-8):(1-3). The organosilicon material has advantages of resistance to environmental hot and cold alternation, non-yellowing and high luminous flux.

Description

technical field [0001] The invention relates to an LED encapsulation material, in particular to an organic silicon material for LED encapsulation with high lumen maintenance rate. Background technique [0002] LED is a light-emitting diode, which is a high-efficiency solid light source, which has the advantages of energy saving and environmental protection, and has a relatively long service life. At present, LED has been widely used in people's daily life and work. Its application principle is to irradiate fluorescent substances with blue light LED to produce yellow light complementary to blue light, and then to obtain white light. [0003] The Energy Star standard requires that the 25,000-hour lifespan LED lamp requires a luminous flux maintenance rate of 91.8% at 6,000 hours, and if the lamp type is a directional lamp, the maximum test ambient temperature is 55°C±5°C, which is quite high. standard requirements. [0004] For example, a kind of LED filament packaging mater...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J183/05C09J187/00C09J11/08C09J11/06C09J11/04H01L33/56
CPCC08K2003/222C08K2201/011C08L2203/206C08L2205/025C08L2205/035C09J11/04C09J11/06C09J11/08C09J183/04H01L33/56C08L83/04C08L87/00C08L33/00C08K3/22
Inventor 邹志文姚斌雄
Owner NINGBO KLITE ELECTRIC MFG
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