A white alkali-soluble photosensitive composition and its preparation method and application

A photosensitive composition and composition technology, applied in the field of photosensitive materials, can solve the problems of increasing the operating procedures and production costs of circuit board factories

Active Publication Date: 2020-08-18
JIANGSU KUANGSHUN PHOTOSENSITIVITY NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this method of operation can improve the risk of solder resist ink cracking, it increases the operating procedures and production costs of the circuit board factory

Method used

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  • A white alkali-soluble photosensitive composition and its preparation method and application
  • A white alkali-soluble photosensitive composition and its preparation method and application
  • A white alkali-soluble photosensitive composition and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] A preparation method of a white alkali-soluble photosensitive composition, the preparation method comprising the steps of:

[0038] (1) First, 100 parts of alkali-soluble photosensitive resin (Chemical Chemical CCR-4969HW), 15 parts of thermoplastic solid acrylic resin (DSM Likang resin B-817), 5 parts of antioxidant (BASF IRGANOX AO 80), 60 parts of photopolymerizable monomers (Eternal Chemical EM265) were mixed, and stirred and dispersed for 20 minutes with a disperser at a speed of 1500 rpm;

[0039] (2) Then add 15.5 parts of photoinitiators (15 parts of Ciba produce Irgacure 907, 0.5 part of Ciba produce IrgacureOXE02), add while stirring, stir and disperse for 10 minutes at a rotating speed of 1500rpm;

[0040] (3) Add 50 parts of epoxy resin (25 parts of Japanese chemical medicine NC3000, 25 parts of Taiwan Changchun CNE202), 0.1 part of amine catalyst (Japan Shikoku Chemical 2E4MZ), 40 parts of diluent (U.S. DOW Chemical Diethylene Glycol Ether Acetate) was sti...

Embodiment 2

[0043] A preparation method of a white alkali-soluble photosensitive composition, the preparation method comprising the steps of:

[0044] (1) First, 100 parts of alkali-soluble photosensitive resin (Chemical Chemical CCR-4969HW), 15 parts of thermoplastic solid acrylic resin (DSM Likang resin B-817), 10 parts of antioxidant (BASF IRGANOX AO 80), 60 parts of photopolymerizable monomers (Eternal Chemical EM265) were mixed, and stirred and dispersed for 20 minutes with a disperser at a speed of 1500 rpm;

[0045] (2) Then add 15.5 parts of photoinitiators (15 parts of Ciba produce Irgacure 907, 0.5 part of Ciba produce IrgacureOXE02), add while stirring, stir and disperse for 10 minutes at a rotating speed of 1500rpm;

[0046] (3) Add 50 parts of epoxy resin (25 parts of Japanese chemical medicine NC3000, 25 parts of Taiwan Changchun CNE202), 0.1 part of amine catalyst (Japan Shikoku Chemical 2E4MZ), 40 parts of diluent (U.S. DOW Chemical Diethylene Glycol Ether Acetate) was st...

Embodiment 3

[0049] A preparation method of a white alkali-soluble photosensitive composition, the preparation method comprising the steps of:

[0050] (1) First, 100 parts of alkali-soluble photosensitive resin (Chemical Chemical CCR-4969HW), 15 parts of thermoplastic solid acrylic resin (DSM Likang resin B-817), 15 parts of antioxidant (BASF IRGANOX AO 80), 60 parts of photopolymerizable monomers (Eternal Chemical EM265) were mixed, and stirred and dispersed for 20 minutes with a disperser at a speed of 1500 rpm;

[0051] (2) Then add 15.5 parts of photoinitiators (15 parts of Ciba produce Irgacure 907, 0.5 part of Ciba produce IrgacureOXE02), add while stirring, stir and disperse for 10 minutes at a rotating speed of 1500rpm;

[0052] (3) Add 50 parts of epoxy resin (25 parts of Japanese chemical medicine NC3000, 25 parts of Taiwan Changchun CNE202), 0.1 part of amine catalyst (Japan Shikoku Chemical 2E4MZ), 40 parts of diluent (U.S. DOW Chemical Diethylene Glycol Ether Acetate) was st...

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PUM

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Abstract

A white alkali-dissolvable photosensitive composition is disclosed. The composition includes, by weight, 100 parts of alkali-dissolvable photosensitive resin, 5-30 parts of thermoplastic solid acrylic resin, 3-20 parts of an antioxidant, 30-90 parts of a photopolymerizable monomer, 5-30 parts of a photoinitiator, 100-200 parts of titanium dioxide, 30-90 parts of epoxy resin, 0.05-0.5 part of an amine catalyst and 30-90 parts of a diluent. A cured film formed from the composition has advantages of no contraction or crack after thermal shock, and no yellowing at high temperature, and can be used for preparing a printed circuit board.

Description

technical field [0001] The invention relates to the technical field of photosensitive materials, in particular to a white alkali-soluble photosensitive composition that will not shrink, crack and yellow at high temperatures after surface treatment of printed circuit boards for automobiles and a preparation method thereof . Background technique [0002] The industry will add one or several thermoplastic solid acrylic resins to the solder resist ink to directly improve the toughness of the solder resist white oil and improve the shrinkage and cracking problems caused by the stress of the solder resist white oil. The thermoplastic solid acrylic resin can increase the system The toughness of the solder resist ink reduces the stress during curing, especially the stress generated in thermal shock, and at the same time increases the adhesion with the printed circuit board, which is of great help to the chemical resistance of the solder resist ink. At the same time, due to the prog...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/033G03F7/027G03F7/031G03F7/029G03F7/004
CPCG03F7/004G03F7/027G03F7/029G03F7/031G03F7/033
Inventor 袁燕华朱民吴来喜安丰磊查晓英
Owner JIANGSU KUANGSHUN PHOTOSENSITIVITY NEW MATERIAL
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