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Receiver heat dissipation device

A cooling device and receiver technology, applied in the field of receivers, can solve the problems of data deviation, affecting the accuracy of measurement results, and the receiver has no cooling device, etc., to achieve the effects of ultra-light weight, improved heat dissipation efficiency, and increased heat conduction area

Inactive Publication Date: 2018-07-20
安徽皇广实业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the receiver is installed in a full-filled box, and the heat generated and accumulated in the box will form a local high temperature. The traditional receiver does not have a corresponding heat dissipation device, so the data collected when working in a high-temperature environment may be There is a large deviation, which affects the accuracy of the measurement results

Method used

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Embodiment Construction

[0014] The preferred embodiments of the present invention will be described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0015] Such as figure 1 A kind of receiver cooling device shown, it comprises copper-aluminum composite box body 1 and integrated circuit board 3, and the front of described integrated circuit board 3 is provided with power amplifier 4, radio frequency chip and power supply chip, and described integrated circuit board 3 Metal foil is laid on the back side of the circuit board, and the metal foil is copper foil. The integrated circuit board 3 is respectively provided with a power amplifier 4, a radio frequency chip and a power chip, and the bottom of the power chip is connected with a hole made of metal foil. There is a thermally conductive adhesive, and the thermall...

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Abstract

The invention discloses a receiver heat dissipation device. The receiver heat dissipation device comprises a copper-aluminum composite box body and an integrated circuit board. A power chip, a radio frequency chip and a power amplifier are arranged on the front side of the integrated circuit board. A metal foil is laid on the back surface of the integrated circuit board. The integrated circuit board is provided with a power amplifier, a radio frequency chip and a power supply chip respectively. The bottom of the power supply chip is connected with a pore channel made of the metal foil. Each pore channel is internally provided with a heat-conducting adhesive. The heat-conducting adhesive is used for bonding the metal foil and the copper-aluminum composite box body. The copper-aluminum composite box body comprises a power supply board body, fastening screws, a power supply chip body and a heat dissipation block. Based on the above two parts, the heat dissipation efficiency of the heat dissipation device is greatly improved. Therefore, it is guaranteed that the accuracy of data reception is not affected by the emperature.

Description

technical field [0001] The present invention relates to the technical field of receivers, in particular, to a heat dissipation device for a receiver. Background technique [0002] Electromagnetic signals emitted by antennas or satellites are fed into receivers. The receiver will generate heat during the acquisition process, especially when the external temperature is high, the temperature of some components on the circuit board of the box will be higher, which will easily lead to changes in some parameters of the components, thus affecting the technical indicators and performance of the instrument . Usually, when designing the structure of the receiver, the main consideration is how to improve its electromagnetic shielding performance, but little consideration is given to how to dissipate heat. However, the receiver is installed in a full-filled box, and the heat generated and accumulated in the box will form a local high temperature. The traditional receiver does not have...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367H01L23/373H01L23/467H04B1/08
CPCH01L23/367H01L23/3736H01L23/467H04B1/08
Inventor 张彩霞
Owner 安徽皇广实业有限公司
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