Multichannel loop type uniform temperature plate

Abstract

The invention discloses a multichannel loop type uniform temperature plate which comprises a heat-conducting main plate body. The main plate body is provided with a heat absorbing part and a heat radiating part; a heat absorbing cavity is arranged in the heat absorbing part; a liquid medium capable of absorbing heat is filled in the heat absorbing cavity; a heat radiating cavity is arranged in theheat radiating part; a liquid medium channel and a steam channel communicating with the heat absorbing cavity and the heat radiating cavity are arranged in the main plate body; the heat absorbing part can absorb external heat and transmits the heat to the liquid medium, and steam produced after the liquid medium absorbs heat can enter the heat radiating cavity through the steam channel; and the heat radiating part can absorb heat of the steam in the heat radiating cavity and radiates the heat to the external environment, and a liquid medium produced through heat radiating and condensing in the heat radiating cavity can return into the heat absorbing cavity through the liquid medium channel. The multichannel loop type uniform temperature plate provided by the invention can be beneficial toeffectively improving the heat transfer efficiency, and is simple in structure, small in size, wide in application range, and convenient to use.

Description

technical field [0001] The invention relates to a temperature equalizing plate. Background technique [0002] Vapor chambers are often used in electronic equipment such as computers and communication products, and are often used to cool down heating elements such as chips. When in use, the heat absorbing part is used to absorb the heat of the heating element, and the heat dissipation part passes through external cooling fins, cooling fans, etc. For heat dissipation, the steam generated by the liquid medium such as water inside flows to the heat dissipation part, and after the heat dissipation part is condensed, it flows back into the heat absorption part, thereby realizing the heat dissipation of the heating element. The steam and liquid passages are always in the same passage, and the steam and liquid often flow in opposite directions in the same passage, which will hinder the flow of the steam and the liquid medium, and the liquid medium that returns after condensation wil...

AI Technical Summary

Problems solved by technology

[0002] Vapor chambers are often used in electronic equipment such as computers and communication products. They are often used to cool down heating elements such as chips. When in use, the heat-absorbing part is used to absorb the heat of the heating element, and the heat-dissipating part is through external cooling fins, cooling fans, etc. For heat dissipation, the steam generated by the liquid medium such as water inside it flows to the heat dissipation part, condenses in the heat dissipation part and then flows back to the heat absorption part, thereby realizing the heat dissipation of the heating element. The existing vapor chamber usually does not have a special Steam and liquid paths, steam and liquid often flow in opposite directions in the same channel, which will hinder the flow of steam and liquid medium, and the liquid medium that returns after condensation will also absorb part of the heat of the steam, which will affect the vapor chamber heat transfer efficiency

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