Thermally conductive components and mobile terminals

A heat-conducting component and mobile terminal technology, applied in the electronic field, can solve the problems that the thermal conductivity cannot meet the heat dissipation requirements, and achieve the effects of lowering the temperature, realizing integration, and meeting the heat dissipation requirements

Active Publication Date: 2020-07-28
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] However, the above-mentioned method of using metal materials and graphite films to realize heat conduction and hea

Method used

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  • Thermally conductive components and mobile terminals
  • Thermally conductive components and mobile terminals
  • Thermally conductive components and mobile terminals

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Embodiment Construction

[0035] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.

[0036] figure 2 It is a schematic diagram of the application scene of the heat conduction component of the embodiment of the present application, figure 2 It can also be called the assembly explosion diagram of the mobile terminal, such as figure 2 The mobile terminal shown includes a front case, a middle board and a rear case, wherein the middle board can play the role of structural bearing, heat conduction and heat uniformity in the mobile terminal. Of course, it can be understood that the mobile terminal can also be provided with a display panel, a touch The control panel, the PCB board carrying electronic components, etc., are not described here. W...

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Abstract

A heat conduction component and a mobile terminal, the heat conduction component is applied to the mobile terminal, and is used to conduct heat for a heat source device of the mobile terminal, the heat conduction component includes: a support part (1) and a heat dissipation part (2), and the inside of the support part (1) is provided with The cavity, the heat dissipation part (2) is arranged in the cavity, and the heat dissipation part (2) has a mesh capillary hole; the heat source device is located at one end of the heat dissipation part (2), and the low temperature area is located at the other end of the heat dissipation part (2). The temperature of the area is lower than the temperature of the area where the heat source device is located; a heat conduction working medium is arranged in the mesh capillary of the heat dissipation part (2), and the heat conduction work medium is used to transfer the heat generated by the heat source device from the heat dissipation part ( 2) is conducted to the other end of the heat dissipation part (2). The heat conduction component conducts heat to the heat source device of the mobile terminal, thereby reducing the temperature of the heat source device.

Description

[0001] This application claims the priority of the Chinese patent application with the application number 201710121682.5 and the application title "A Thermal Conductive Material Applied to Mobile Terminals" filed with the China Patent Office on March 2, 2017, the entire contents of which are incorporated by reference In this application. technical field [0002] The present application relates to electronic technology, in particular to a heat-conducting component and a mobile terminal. Background technique [0003] With the development of wireless communication technology, mobile terminals such as mobile phones and tablet computers have been widely used. A mobile terminal generally includes a front case, a metal mid-plane, a rear case and various electronic devices. Wherein, the electronic device may be arranged on a printed circuit board (Printed Circuit Board, PCB), and the PCB may be arranged on the metal middle board through screws. The PCB is divided into upper and lo...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20H05K7/20336G06F1/203
Inventor 姜华文靳林芳
Owner HUAWEI TECH CO LTD
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