Method for manufacturing circuit board, circuit board and mobile terminal

Abstract

The invention provides a circuit board manufacturing method, a circuit board, and a mobile terminal. The method comprises the steps: providing a metal plate; forming a first groove, corresponding to apreset pattern, on the first surface of the metal plate; Setting first insulating layers on the first surface of the metal plate and the first groove, and setting a first conductive layer at one side, far from the metal plate, of each first insulating layer; forming a second groove, corresponding to the preset pattern, on the second surface of the metal plate, wherein the second groove is communicated with the first groove; forming a plurality of metal heat dissipation blocks; setting second insulating layers on the second surface of the metal plate and the second groove, setting a second conductive layer at one side, far from the metal plate, of each second insulating layer, and forming an initial circuit board; forming a first circuit connected with the metal heat dissipation blocks onthe first conductive layer of the initial circuit board, forming a second circuit connected with the metal heat dissipation blocks on the second conductive layer, and obtaining a circuit board. Therefore, the method can solve a problem that a conventional circuit board is warped because of the non-uniform stress.

Description

technical field [0001] The invention relates to the field of communication technology, in particular to a method for manufacturing a circuit board, a circuit board and a mobile terminal. Background technique [0002] In the field of integrated circuits, electronic components on circuit boards will generate heat during operation, especially for circuit boards with dense lines and dense holes, or for circuits with components such as high-power light-emitting diodes board, which has high heat dissipation requirements for the circuit board. [0003] At present, in order to improve the heat dissipation effect of the circuit board, a metal block with high thermal conductivity is generally embedded in the base material of the circuit board to form a circuit board with good heat dissipation performance. The specific production process is to expose, develop and etch the initial metal plate according to the target pattern to obtain a metal block with the target image, then form the i...

AI Technical Summary

Problems solved by technology

[0006] Embodiments of the present invention provide a method for manufacturing a circuit board, a circuit board, and a mobile terminal, so as to solve the problem that existing circuit boards are warped due to uneven stress

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