Method for processing a first substrate bonded to a second substrate
A technology of substrates and bonding angles, applied in the direction of circuit substrate materials, chemical instruments and methods, applications, etc., can solve problems such as damage, time-consuming glass substrates, and reduced strength of glass substrates
Active Publication Date: 2020-11-27
CORNING INC
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Problems solved by technology
However, some conventional debonding techniques can be difficult, time consuming and can even cause damage to the glass substrate
In fact, typical debonding techniques may cause glass substrates to fail (e.g., crack the glass substrate), crack the glass substrate, and / or introduce edge defects that reduce the strength of the glass substrate
Method used
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[0018] Exemplary embodiments will be described in more detail below with reference to the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings to refer to the same or like parts. The subject matter covered by the claims may, however, be embodied in many different forms and should not be construed as limited to the implementations set forth herein.
[0019] Directional terms (eg, up, down, left, right, front, back, top, bottom) as used herein are in reference to the drawing figures only and are not intended to imply absolute orientations.
[0020] Embodiments may be utilized to facilitate removal of a first substrate bonded to a second substrate. For example, some embodiments can facilitate initial separation, partial separation, or even complete separation of a first substrate (eg, a glass substrate) from a second substrate (eg, a carrier substrate).
[0021] In some embodiments, the first substrates of the present disclos...
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Abstract
The method of processing a first substrate bonded to a second substrate includes moving a wire along an interface to expand a debond front and debond the first substrate from the second substrate. In some embodiments, the first substrate comprises a thickness of less than or equal to about 300 μm. In other embodiments, the wire comprises a tensile strength less than the critical failure stress of the first substrate. In additional embodiments, the wire is configured to conform to the shape of the debonding front during the step of moving the wire such that one or more edges of the first substrate are first debonded from the second substrate prior to the debonding. A corresponding interior portion of the first substrate is debonded from the second substrate.
Description
[0001] Cross References to Related Applications [0002] This application claims the benefit of priority under 35 U.S.C. §119 to U.S. Provisional Application Serial No. 62 / 248823, filed October 30, 2015, upon which this application is based and incorporated by reference in its entirety This article. technical field [0003] The present disclosure relates generally to methods of processing a first substrate bonded to a second substrate, and more particularly, to methods of debonding a first substrate from a second substrate. Background technique [0004] Glass substrates are commonly used in, for example, display applications including liquid crystal displays (LCDs), electrophoretic displays (EPDs), organic light emitting diode displays (OLEDs), plasma display panels (PDPs), and the like. Typically, these glass substrates are manufactured from glass ribbons that are drawn from a quantity of molten material using various glass ribbon forming techniques such as slot draw, floa...
Claims
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IPC IPC(8): H05K3/40H05K1/03
CPCB32B2457/20B32B43/006H05K1/0306H05K3/40H05K2201/0145Y10T156/1184Y10T156/1967Y10T156/1961B32B38/10
Inventor L·K·萨胡
Owner CORNING INC