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Ultra wide band multi-way microwave power combiner

A microwave power, ultra-broadband technology, applied in the direction of waveguide type devices, circuits, electrical components, etc., can solve the problem of high synthesis efficiency, and achieve the effects of high synthesis efficiency, simple structure, and high power resistance

Active Publication Date: 2018-08-03
GUANGDONG SHENGDA ELECTRONICS
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0010] Aiming at the problems of bandwidth, combining efficiency and processing complexity in the existing power combining methods, the present invention proposes a combining device with simple structure, arbitrarily multi-channel combining, bandwidth covering one octave, and high power resistance; The device uses a large-diameter coaxial cavity TEM transmission mode to realize multiple synthesis, the number of channels can be freely determined, and the synthesis efficiency is high

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  • Ultra wide band multi-way microwave power combiner

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Embodiment 1

[0032] Embodiment 1. This embodiment is an ultra-wideband multi-channel microwave power combiner. In fact, the power combiner mainly has two implementation forms: channel synthesis and field synthesis, respectively as follows: figure 1 and figure 2 shown. The way of synthesis is as figure 1 As shown, the power is input from N branch lines respectively, and the combined power is output from the central feeding point 001. Each branch of a common circuit synthesis circuit is composed of microstrips. As shown in the figure, 1, 2, 3...N medium microstrips, and the central feeding point 001 is led out vertically by a coaxial connector. In order to ensure the synthesis efficiency, each branch needs to meet the Certain amplitude and phase requirements are required. The most common implementation form is the radial branch of the microstrip line, and each channel maintains the same amplitude and phase. This form requires multiple step changes in the microstrip or coaxial part to ach...

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Abstract

The invention provides an ultra wide band multi-way microwave power combiner which comprises a coaxial inner conductor and a coaxial outer conductor, wherein the coaxial outer conductor comprises an outer conical conductor part and an outer columnar conductor part; the coaxial inner conductor comprises an inner conical conductor part and an inner columnar conductor part; the vertex angle of the inner conical conductor part is smaller than that of the outer conical conductor part; a gradual-change coaxial cavity is formed between the outer wall of the inner conical conductor part and the innerwall of the outer conical conductor part; a TEM (Transverse Electric and Magnetic Field) coaxial cavity is formed between the outer wall of the inner conical conductor part and the inner wall of the outer conical conductor part. The power combiner is a circuit combination device which is simple in structure, feasible in multi-way combination, feasible in multi-frequency interval covering with onebandwidth, and good in high power resistance; by adopting the device, multi-way combination is achieved in a large-diameter coaxial cavity TEM transmission mode, combination ways can be determined freely, and high combination efficiency can be achieved.

Description

technical field [0001] The invention relates to the field of high-power transmitters, in particular to an ultra-wideband multi-path microwave power combiner. Background technique [0002] High-power transmitters are widely used in radar, measurement and control, communication and electronic countermeasures and other fields, and are key components of defense industry and military electronic equipment. High-power microwave amplifiers are the core components of high-power transmitters. Traditional high-power microwave amplifiers use vacuum tube devices, which have narrow operating bandwidths and short service life, so their applications are limited. Compared with traditional electric vacuum devices, semiconductor solid-state amplifiers have significant advantages in terms of volume, weight, cost, reliability, and operating bandwidth. However, with the increase of operating frequency, especially in the millimeter wave band, the output power of solid-state active devices is redu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01P5/12
CPCH01P5/12
Inventor 卜景鹏马向华梁锦飞刘忠程
Owner GUANGDONG SHENGDA ELECTRONICS