Package structure of micro LED display module

Abstract

The invention discloses a package structure of a micro LED display module. The package structure comprises a circuit board, multiple light-emitting units, and a transparent package layer; each light-emitting unit comprises a first flip blue-light chip, a flip green-light chip and a second flip blue-light chip; the first flip blue-light chip, the flip green-light chip and the second flip blue-lightchip are orderly fixed on the circuit board, the gaps between the light-emitting units, between the first flip blue-light chip and the flip green-light chip, and between the flip green-light chip andthe second flip blue-light chip are filled by using filing layers; a red fluorescent layer is coated on the first flip blue-light chip or the second flip blue-light chip; and the transparent packagelayer wraps the whole surface of the circuit board and the light-emitting units. The package structure disclosed by the invention reduces the gaps among the LED particles when a surface mount device is in mounting, the single light-emitting unit size is greatly reduced to the micron order, the light-emitting unit density is improved, and the final display resolution is improved; and the problem ofthe thermal drift color aberration of the display screen is improved.

Description

technical field [0001] The invention relates to the technical field of LED packaging, in particular to a packaging structure of a miniature LED display module. Background technique [0002] At present, outdoor display screens on the market mainly use full-color LED SMD devices, and multiple full-color LED devices are surface-mounted on the circuit board to form a full-color LED array, and finally play the role of outdoor display. Among them, SMD LED devices are packaged in the way of front-mounted chips. Due to the limitations of front-mounted chip packaging, the size of SMD LED packages in the current market is close to the limit, and it is difficult to further reduce the size of the device and improve the resolution of the display screen; The method of surface-mounting the chip device to the circuit board is limited by the circuit board and the SMT process, and there is a large gap between the LEDs, which also makes the resolution of the display screen unable to be further...

AI Technical Summary

Problems solved by technology

Among them, SMD LED devices are all packaged in the way of front-mounted chips. Due to the limitations of front-mounted chip packaging, the package size of SMD LEDs in the current market is close to the limit, and it is difficult to further reduce the size of the device and improve the resolution of the display screen; The method of surface-mounting the chip device to the circuit board is limited by the circuit board and the SMT process, and there is a large gap between the LEDs, which also makes the resolution of the display screen unable to be further improved.

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