Nontoxic copper-iron based silver stripping solution and stripping technology thereof

A deplating solution and copper-iron technology, which is applied in the field of non-toxic copper-iron-based silver deplating solution and its deplating process, can solve the problems of short deplating completion cycle and achieve short deplating completion cycle and workpiece quality assurance High, comprehensive deplating performance and strong effect

Inactive Publication Date: 2018-08-21
泉州市蓝水环保科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the above existing problems, the present invention proposes a non-toxic copper-iron-based silver stripping solution and its stripping process. Through reasonable formula improvement, the penetration of the stripping solution is effectively improved, and the electrolysis efficiency is obviously improved. The completion period is short, t

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  • Nontoxic copper-iron based silver stripping solution and stripping technology thereof

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Embodiment 1

[0022] A non-toxic copper-iron-based silver stripping solution, comprising the following components in mass percentage: 10% oxidizing agent, 25% complexing agent, 8% composite surfactant, water balance, wherein the oxidizing agent is a combination of hydrogen peroxide and ammonia water The complexing agent includes glycine, citrate, triethanolamine, and the composite surfactant includes alkyl sugar amine type surfactant and anionic surfactant, and also includes buffering agent 6%, and the buffering agent includes acetate and thiourea.

[0023] Wherein: water adopts deionized water, hydrogen peroxide adopts mass fraction 35%, ammoniacal liquor adopts mass fraction 25%, citrate adopts sodium citrate; Acetate adopts sodium acetate, and the mass ratio of acetate and thiourea is 2: 2. The amount of ammonia added in the oxidant is 10% of the mass of hydrogen peroxide; the molar ratio of glycine, citrate, and triethanolamine in the complexing agent is 1:2:1, and the complexing agent ...

Embodiment 2

[0029] A non-toxic copper-iron-based silver stripping solution, comprising the following components in mass percentage: 15% oxidizing agent, 40% complexing agent, 5% composite surfactant, and water balance, wherein the oxidizing agent is a combination of hydrogen peroxide and ammonia water The complexing agent includes glycine, citrate, triethanolamine, and the composite surfactant includes alkyl sugar amine type surfactant and anionic surfactant, and also includes buffering agent 4%, and the buffering agent includes acetate and thiourea.

[0030] Wherein: water adopts deionized water, hydrogen peroxide adopts mass fraction 35%, ammoniacal liquor adopts mass fraction 25%, citrate adopts sodium citrate; Acetate adopts sodium acetate, and the mass ratio of acetate and thiourea is 4: 2. The amount of ammonia added in the oxidant is 10% of the mass of hydrogen peroxide; the molar ratio of glycine, citrate, and triethanolamine in the complexing agent is 1:2:1, and the complexing ag...

Embodiment 3

[0033] A non-toxic copper-iron-based silver stripping solution, comprising the following components in mass percentage: oxidant 12%, complexing agent 45%, composite surfactant 5%, water balance, wherein the oxidant is a combination of hydrogen peroxide and ammonia The complexing agent includes glycine, citrate, triethanolamine, and the composite surfactant includes an alkyl sugar amine type surfactant and anionic surfactant, and also includes buffering agent 10%, and the buffering agent includes acetate and thiourea.

[0034]Wherein: water adopts deionized water, hydrogen peroxide adopts mass fraction 35%, ammoniacal liquor adopts mass fraction 25%, citrate adopts potassium citrate; Acetate adopts potassium acetate, and the mass ratio of acetate and thiourea is 3: 2. The amount of ammonia added in the oxidant is 20% of the mass of hydrogen peroxide; the molar ratio of glycine, citrate, and triethanolamine in the complexing agent is 1:2:2, and the complexing agent also contains...

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Abstract

The invention provides a nontoxic copper-iron based silver stripping solution and a stripping technology thereof. The stripping solution comprises following components in percentage by weight: 8 to 12% of oxidizing agent, 25 to 45% of complexing agent, 3 to 9% of composite surfactant, and the balance being water, wherein the oxidizing agent is a composition of hydrogen peroxide and ammonia water,the complexing agent comprises glycine, citrate, and triethanolamine, and the composite surfactant comprises an alkyl glycosylamine type surfactant and an anion type surfactant. By improving the formula of the stripping solution, the osmotic effect of the stripping solution is effectively enhanced, the electrolysis efficiency is obviously improved; the stripping period is short, the content of free ions is less than 0.08%; the comprehensive stripping performance is strong, the product quality is guaranteed effectively after stripping; and moreover, the stripping solution does not contain any toxic pollutant, can be degraded easily, meets the requirements of modern industry, and is worthy to promote.

Description

technical field [0001] The invention relates to the technical field of chemical silver deplating technology, in particular to a non-toxic copper-iron-based silver deplating solution and a deplating process thereof. Background technique [0002] There are many surface treatment technologies for materials, and silver plating is only one of the more traditional processes, but many advanced surface treatment technologies cannot completely replace this process. So far, the silver plating process is still widely used in the surface treatment fields of precision instruments, printed circuit boards, integrated circuits, casings, electrical contacts, etc. In industrial production applications, there are two types of silver plating processes: electroplating and electroless plating. The choice of the silver plating process is closely related to the substrate material. Generally speaking, electroplating silver plating is used for metal material substrates, and chemical silver plating i...

Claims

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Application Information

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IPC IPC(8): C25F5/00
CPCC25F5/00
Inventor 蔡其旺肖自军
Owner 泉州市蓝水环保科技有限公司
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