A BIM-based settlement method and device for empc manufacturing link
A link and mechanism technology, applied in the field of settlement methods and devices in the EMPC manufacturing process, can solve problems such as failure to meet the settlement requirements of the EPMC mode, substandard quantity and quality, and abnormal quality of components and materials, so as to improve user experience and work efficiency. , Improve accuracy and efficiency, and facilitate the effect of checking orders
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[0042] In order to enable those skilled in the art to better understand the solution of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0043] The terms "first", "second", "third" and "fourth" in the specification and claims of this application and the above drawings are used to distinguish different objects, rather than to describe a specific order . Furthermore, the terms "comprising" and "having", and any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, product, or device compris...
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