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Fabrication method of plating thick copper on local hole wall and PCB

A manufacturing method and hole-wall copper technology are applied in the fields of printed circuit manufacturing, printed circuit components, and electrical connection formation of printed components, which can solve problems such as inability to design through holes that meet different copper thickness requirements, and reduce copper plating Effects of Difficulty, Boost and Efficiency

Active Publication Date: 2018-08-24
DONGGUAN SHENGYI ELECTRONICS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a manufacturing method and PCB for partial hole wall thick copper plating, which solves the problem that the traditional processing technology cannot design through holes that meet different copper thickness requirements on the same PCB.

Method used

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  • Fabrication method of plating thick copper on local hole wall and PCB
  • Fabrication method of plating thick copper on local hole wall and PCB
  • Fabrication method of plating thick copper on local hole wall and PCB

Examples

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Embodiment 1

[0037] see figure 1 , present embodiment provides a kind of manufacturing method of partial hole wall thick copper plating, comprising steps:

[0038] Step 101 , according to the normal process, after the inner layer pattern is made, a plurality of core boards are pressed together to form a multi-layer board with auxiliary electroplating inner leads.

[0039] Step 102, opening a number of first through holes 1 and a number of second through holes 2 on the multilayer board, and then performing copper plating for the first time, so that the copper thickness of the first through hole 1 reaches the preset second through hole 1. A copper thickness standard value, the second through hole 2 is connected to the auxiliary plating inner lead, such as figure 2 shown.

[0040] In this embodiment, according to different design requirements for the copper thickness of the hole wall, the through holes opened on the multilayer board are divided into two specifications with different hole w...

Embodiment 2

[0059] The second embodiment provides a PCB, which includes the first through hole 1 and the second through hole 2 manufactured according to the method provided in the first embodiment.

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Abstract

The invention relates to the technical field of a PCB, and discloses a fabrication method of plating thick copper on a local hole and the PCB. The fabrication method comprises the steps of fabricatinga multi-layer board which is provided with an auxiliary electroplating inner lead, at least one first through hole and at least one second through hole from multiple core boards; performing first-time copper electroplating so that the copper thickness of a hole wall of the first through hole reaches a preset first copper thickness standard value; removing a copper layer on a hole ring region of the second through hole; pasting an anti-plating film on a surface of the multi-layer board, and forming a window in a designated position of the anti-plating film, wherein the designated position comprises a corresponding position of each second through hole; and performing second-time copper electroplating until the copper thickness of a hole wall of the through hole reaches a preset standard copper thickness standard value, wherein the second copper thickness standard value is larger than the first copper thickness standard value. By employing the fabrication method, the purpose of only plating the thick copper on the hole walls of a part of holes can be achieved, board grinding operation cannot be needed, the copper plating effect and efficiency also can be improved, and particularly, the fabrication method is used for a through hole with high thickness-to-diameter ratio.

Description

technical field [0001] The invention relates to the technical field of PCB (Printed Circuit Board, printed circuit board), in particular to a method for manufacturing a local hole wall with thick copper plating and a PCB. Background technique [0002] With the development of electronic circuit technology from single function to multi-integration technology, and in order to save board wiring space, in the design of PCB electronic products, it is necessary to allow some through holes to carry small currents, and to allow other parts of through holes to carry large currents. It is necessary to design through holes that meet different copper thickness requirements on the same PCB. [0003] However, according to the traditional processing method, the copper thickness of each through hole on the PCB will be consistent, and the copper thickness is thin (≤1mil), which can only meet the design requirements of small current transmission, but cannot meet the design requirements of larg...

Claims

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Application Information

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IPC IPC(8): H05K3/42H05K1/11
CPCH05K1/115H05K3/423H05K3/429H05K2201/095
Inventor 辜义成纪成光王善进宋祥群
Owner DONGGUAN SHENGYI ELECTRONICS