Ultrasonic touch apparatus and manufacturing method thereof

A technology of a touch device and a manufacturing method, which is applied in the direction of instruments, electrical digital data processing, and input/output processes of data processing, etc., can solve the problems that conductive glue and conductive pins cannot be electrically connected normally, so as to avoid tolerance accumulation, Effect of avoiding tolerance and improving yield

Active Publication Date: 2018-09-04
INTERFACE TECH CHENGDU CO LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the two tolerances accumulate to a certain extent, the conductive glue and the conductive pins will not be electrically connected normally.

Method used

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  • Ultrasonic touch apparatus and manufacturing method thereof
  • Ultrasonic touch apparatus and manufacturing method thereof
  • Ultrasonic touch apparatus and manufacturing method thereof

Examples

Experimental program
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Effect test

no. 1 example

[0025] The manufacturing method of the ultrasonic touch device according to the preferred embodiment of the present invention includes the following steps:

[0026] see Figure 3A , Step S1: providing an ultrasonic sensing module 301, the ultrasonic sensing module 301 includes an ultrasonic transmitting unit 310 and an ultrasonic receiving unit 320 arranged in a stack.

[0027] The ultrasonic emitting unit 310 includes a first piezoelectric sheet 311 , a first electrode 312 and a second electrode 313 . The first electrode 312 completely covers a first surface 3112 of the first piezoelectric sheet 311 and extends from the first surface 3112 to a second surface 3114 opposite to the first surface 3112, and the second electrode 313 is disposed on the second surface. On the surface 3114 , the second electrode 313 is not in contact with the first electrode 312 . The ultrasonic receiving unit 320 includes a second piezoelectric sheet 321 and a third electrode 322 and a fourth elect...

no. 2 example

[0049] Such as Figure 5 As shown, is a schematic structural diagram of the ultrasonic touch device 600 manufactured by the method for manufacturing the ultrasonic touch device.

[0050] The ultrasonic touch device 600 includes an ultrasonic sensing module 601 , conductive pins 641 , packaging glue 650 and a cover 660 .

[0051] The ultrasonic sensing module 601 includes an ultrasonic transmitting unit 610 and an ultrasonic receiving unit 620 . The ultrasonic emitting unit 610 includes a first piezoelectric sheet 611 , a first electrode 612 and a second electrode 613 . The first electrode 612 completely covers a first surface 6112 of the first piezoelectric sheet 611 and extends from the first surface 6112 to a second surface 6114 opposite to the first surface 6112. The second electrode 613 is arranged on the same side as the first electrode. 612 Completely covered surface opposite surface such as Figures 6A-6B As shown, on the surface where the first electrode 612 and the...

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PUM

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Abstract

The invention discloses a manufacturing method of an ultrasonic touch apparatus. The method comprises the following steps of providing an ultrasonic sensing module and multiple conductive pins, and electrically connecting the conductive pins to the ultrasonic sensing module; providing a mould with an opening, fixing the ultrasonic sensing module in the mould, and enabling one ends, not connected with the ultrasonic sensing module, of the conductive pins to extend out of the mould through the opening; and injecting a packaging adhesive into the mould, performing solidification, enabling the packaging adhesive to wrap the ultrasonic sensing module, and enabling the one ends, not connected with the ultrasonic sensing module, of the conductive pins to be exposed out of the packaging adhesive.The invention furthermore provides the ultrasonic touch apparatus manufactured by the manufacturing method.

Description

technical field [0001] The invention relates to a manufacturing method of an ultrasonic touch device and an ultrasonic touch device manufactured by the method. Background technique [0002] Ultrasonic touch devices have a wide range of applications, and there is a large demand in the market. In the existing manufacturing method of ultrasonic touch devices, it is necessary to first inject and mold the packaged plastic shell. Conductive pins are embedded on the shell, one end of the conductive pins penetrates the packaging plastic shell and extends into the accommodation space defined by the packaging plastic shell, and the other end is located outside the packaging plastic shell; Glue; and then the packaged plastic shell and the ultrasonic sensing unit are bonded to each other, so that the conductive pins are electrically connected to the corresponding electrodes of the ultrasonic sensing unit. When the conductive pins are embedded in the packaging plastic shell, there is a ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F3/043
CPCG06F3/043G06F2203/04103
Inventor 叶颖隆曾钧麟
Owner INTERFACE TECH CHENGDU CO LTD
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