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Method, device and electronic equipment for determining storage life of resin adhesive

A technology of storage life and determination method, applied in the field of resin adhesive storage life and accelerated test, can solve the problem of not being able to accurately obtain the storage life of epoxy resin adhesive, and achieve the relationship between full consideration, high convergence accuracy, and accurate accelerated life estimation. Effect

Active Publication Date: 2022-04-08
BEIJING INST OF AEROSPACE CONTROL DEVICES
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  • Abstract
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AI Technical Summary

Problems solved by technology

[0007] Using the Arrhenius model to establish the relationship between accelerated life and temperature, it can be seen that the relationship between the logarithm of the accelerated life and the reciprocal of the temperature is a linear function relationship, but in the accelerated life test data of epoxy resin adhesives, it can be seen that the acceleration The logarithm of the life and the reciprocal of the temperature are not a simple quadratic relationship, so the traditional Arrhenius model cannot well establish the relationship between the accelerated life of the epoxy resin adhesive and the temperature, so that the exact value of the epoxy resin adhesive cannot be obtained. Storage life

Method used

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  • Method, device and electronic equipment for determining storage life of resin adhesive
  • Method, device and electronic equipment for determining storage life of resin adhesive

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Embodiment 1

[0082] This embodiment adopts the calculation method of the epoxy resin adhesive storage life of the present invention, the failure condition of the epoxy resin is that the tensile shear strength P is less than 20.5Mpa condition, according to the fitting adhesive shear strength change rate of the model, obtain four The failure time under the accelerated test temperature is: 393.15K (120°C) failure life is 318.77 days, 413.15K (140°C) is 120.15 days, 433.15K (160°C) is 52.62 days, 453.15K (180°C) failure life is 24.76 days.

[0083] According to the relationship between epoxy resin failure life and temperature The results obtained by fitting the least squares method are as follows: image 3 as shown in image 3 Shown is a schematic diagram of the agreement between the storage life obtained by the method of the present invention and the actual measured value in embodiment 1; wherein a=1.251×10 6 , b=1626.395, c=-12.369, the goodness of fit is 99.996%. At the same time, it can...

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Abstract

The invention relates to a method, device and electronic equipment for determining the storage life of a resin-type adhesive. By improving the Arrhenius model, the quadratic relationship between the logarithm of the accelerated life of the resin-type adhesive and the reciprocal of the temperature is established, thereby obtaining the resin-type adhesive. The relationship between the accelerated life of the adhesive and the temperature is obtained to obtain its actual storage life at a normal storage temperature. This method has a higher degree of fitting for the life and temperature, and the storage life of the obtained epoxy resin adhesive is also more accurate; the present invention Expand the nonlinear relationship between temperature and accelerated life, and use the improved model for data fitting, which solves the problem that the traditional Arrhenius cannot reproduce the relationship between the high-order term of temperature and life, and reduces the life estimation error; The invention updates the calculation at different temperatures. Compared with the existing methods, the present invention is not only applicable to the life estimation of resin adhesives at low temperature, but also applicable to the situation of high temperature life estimation.

Description

technical field [0001] The invention relates to a method, device and electronic equipment for determining the storage life of a resin adhesive, in particular to a method, device and electronic equipment for determining the storage life of a thermosetting resin adhesive, belonging to the technical field of storage life and accelerated testing of resin adhesives. Background technique [0002] Resin-based adhesives have a long history, especially thermosetting resin-based adhesives (such as epoxy resin adhesives), which used natural products as adhesives in the early days. With the development of science and technology, especially the development of the aerospace industry and the development of synthetic polymer materials, Synthetic adhesives have gradually been widely used in structural connection, equipment repair and sealing. As a kind of adhesive widely used in aviation, aerospace and other fields, resin adhesive has extensive and in-depth performance assessment to ensure t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G16C60/00G06F30/20G06F119/02G06F119/04
CPCG06F30/20
Inventor 翟天祺陈立桐江麒
Owner BEIJING INST OF AEROSPACE CONTROL DEVICES
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