Method for confirming storage service life of resin adhesive and device and electronic equipment

A storage life and determination method technology, applied in the direction of electrical digital data processing, design optimization/simulation, special data processing applications, etc., can solve the problems of inaccurately obtaining the storage life of epoxy resin adhesives, etc., to achieve accurate life estimation and storage Accurate life, extended effect of nonlinear relationship

Active Publication Date: 2018-09-14
BEIJING INST OF AEROSPACE CONTROL DEVICES
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Using the Arrhenius model to establish the relationship between accelerated life and temperature, it can be seen that the relationship between the logarithm of the accelerated life and the reciprocal of the temperature is a linear function relationship, but in the accelerated life test data of epoxy resin adhesives, it can be seen that the acceleration The logarithm of the life and the reciprocal of the temperature are not a simple quadratic relationship, so the traditional Arrhenius model cannot well establish the relationship between the accelerated life of the epoxy resin adhesive and the temperature, so that the exact value of the epoxy resin adhesive cannot be obtained. Storage life

Method used

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  • Method for confirming storage service life of resin adhesive and device and electronic equipment
  • Method for confirming storage service life of resin adhesive and device and electronic equipment
  • Method for confirming storage service life of resin adhesive and device and electronic equipment

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Embodiment 1

[0082] This embodiment adopts the calculation method of the epoxy resin adhesive storage life of the present invention, the failure condition of the epoxy resin is that the tensile shear strength P is less than 20.5Mpa condition, according to the fitting adhesive shear strength change rate of the model, obtain four The failure times under the accelerated test temperature are: 393.15K (120℃) failure life is 318.77 days, 413.15K (140℃) failure life is 120.15 days, 433.15K (160℃) failure life is 52.62 days, 453.15K (180°C) failure life is 24.76 days.

[0083] According to the relationship between epoxy resin failure life and temperature The results obtained by fitting the least squares method are as follows: image 3 as shown in image 3 Shown is a schematic diagram of the agreement between the storage life obtained by the method of the present invention and the actual measured value in Example 1; wherein a=1.251×10 6 , b=1626.395, c=-12.369, the goodness of fit is 99.996%, and...

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Abstract

The invention relates to a method for confirming the storage service life of a resin adhesive and a device and electronic equipment. The method comprises the following steps: by improving an Arrheniusmodel, establishing a secondary relationship of a logarithm of an acceleration service life of a resin adhesive and a temperature reciprocal so as to obtain a relationship of the acceleration servicelife and the temperature of the resin adhesive; calculating an actual storage service life of the resin adhesive at a normal storage temperature. By adopting the method, relatively high fit goodnessof service lives and temperatures can be achieved, and the storage service life of an epoxy resin adhesive is relatively accurate; a nonlinear relationship of temperatures and acceleration service lives can be widened, data fitting can be carried out through an improved model, the problem that the relationship of high secondary items of temperatures and service lives cannot be reproduced by usinga conventional Arrhenius method is solved, and service life estimation errors can be reduced; calculation can be updated at different temperatures, and compared with a conventional method, the methodis not only applicable to service life pre-estimation on the resin adhesive at a low temperature, and is also applicable to situations of high-temperature service life estimation.

Description

technical field [0001] The invention relates to a method, device and electronic equipment for determining the storage life of a resin adhesive, in particular to a method, device and electronic equipment for determining the storage life of a thermosetting resin adhesive, belonging to the technical field of storage life and accelerated testing of resin adhesives. Background technique [0002] Resin-based adhesives have a long history, especially thermosetting resin-based adhesives (such as epoxy resin adhesives), which used natural products as adhesives in the early days. With the development of science and technology, especially the development of the aerospace industry and the development of synthetic polymer materials, Synthetic adhesives have gradually been widely used in structural connection, equipment repair and sealing. As a kind of adhesive widely used in aviation, aerospace and other fields, resin adhesive has extensive and in-depth performance assessment to ensure t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
CPCG06F30/20
Inventor 翟天祺陈立桐江麒
Owner BEIJING INST OF AEROSPACE CONTROL DEVICES
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