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Device for enhancing heat dissipation efficiency of jet radiator, heat dissipation component and manufacturing method

A technology of heat dissipation efficiency and heat dissipation components, applied in the direction of cooling/ventilation/heating transformation, etc., can solve the problem of sharp increase in heat flow density of electronic equipment, and achieve the effect of reducing thermal resistance, enhancing convective heat transfer intensity, and enhancing fluid disturbance.

Active Publication Date: 2019-09-10
SHANDONG CHAOYUE DATA CONTROL ELECTRONICS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

What follows is a sharp increase in the heat flux of electronic equipment, which will pose new challenges for the thermal design of electronic equipment

Method used

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  • Device for enhancing heat dissipation efficiency of jet radiator, heat dissipation component and manufacturing method
  • Device for enhancing heat dissipation efficiency of jet radiator, heat dissipation component and manufacturing method
  • Device for enhancing heat dissipation efficiency of jet radiator, heat dissipation component and manufacturing method

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Embodiment Construction

[0040] In order to make the purpose, features and advantages of the present invention more obvious and understandable, the technical solutions protected by the present invention will be clearly and completely described below using specific embodiments and accompanying drawings. Obviously, the implementation described below Examples are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in this patent, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this patent.

[0041] It will be understood that when an element or layer is referred to as being "on," "connected" or "coupled" to another element or layer, it may be directly on, connected to, or directly on the other element or layer. Or coupled to said another element or layer, intervening elements or layers may also be present. In contrast, when an element is referred to as being "directly on," "di...

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Abstract

The invention provides a device capable of enhancing the heat dissipation efficiency of a jet radiator, a heat dissipation component and a production method. The device comprises a device body, wherein a bottom cover is arranged at the bottom of the device body; the bottom cover is provided with a plurality of conical bulges; an ejection cavity is arranged in the upper part of the bottom cover; the bottom surface of the ejection cavity is provided with a plurality of nozzles; a top cover is arranged at the top of the ejection cavity; and a heat dissipation cavity is arranged between the bottomcover and the bottom surface of the ejection cavity. Liquid-cooled working mediums are subjected to jet impingement to structural top ends of the conical bulges and flow downwards along the wall surfaces of the conical bulges, formation of a boundary layer of a jet impingement cooling wall jet region is destroyed by virtue of the structure characteristics of the conical bulges and the gravity action, meanwhile, regional liquid-cooled working mediums among the conical bulges have relatively large kinetic energy, the liquid-cooled working mediums in different directions collide with one anotherand the flow disturbance is further enhanced, thereby reducing heat resistance in the heat transfer process and enhancing the convection heat transfer intensity.

Description

technical field [0001] The invention relates to the field of heat dissipation of electronic devices, in particular to a device for enhancing heat dissipation efficiency of a jet radiator, a heat dissipation assembly and a manufacturing method. Background technique [0002] The size and volume of electronic components and their assembled electronic equipment are getting smaller and smaller, and the corresponding integration density is greatly increased. High heat flux electronic equipment has been formed and will reach a very high level with a faster development trend. What follows is a sharp increase in the heat flux of electronic equipment, which poses new challenges for the thermal design of electronic equipment. [0003] Jet impingement cooling is also called jet impingement cooling. Jet impingement cooling means that the fluid is sprayed directly to the cooled surface through a nozzle of a certain shape (round or slit shape), and a forced convective flow is generated on ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
Inventor 赵瑞东龚振兴王雪李清臣
Owner SHANDONG CHAOYUE DATA CONTROL ELECTRONICS CO LTD
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