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Chip packaging machine

A packaging machine and chip technology, applied in the direction of conveyor objects, transportation and packaging, electrical components, etc., can solve the problem of low processing efficiency

Inactive Publication Date: 2018-09-28
王加骇
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage of existing chip packaging equipment is that the processing efficiency is low

Method used

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  • Chip packaging machine
  • Chip packaging machine
  • Chip packaging machine

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Experimental program
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Embodiment Construction

[0029] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0030] Such as Figure 1-Figure 15 The shown chip packaging machine includes a frame assembly 1 and a chip feeding device 2 on it, a chip positioning device 3, a handling robot device 4 and an automatic packaging device 5; the chip feeding device 2 is fixedly arranged on the frame assembly 1 , the chip feeding device 2 is used to realize the feeding function of the chips to be packaged. The chip positioning device 3 is connected with the chip feeding device 2, and the chip positioning device 3 is used for positioning the chips to be packaged to improve the accuracy of clamping. The conveying manipulator device 4 is used for conveying chip workpieces between the chip feeding device 2 , the chip positioning device 3 and the automatic packaging device 5 . The automatic packaging device 5 is connected with the chip positioning device 3, and the automatic ...

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Abstract

The invention relates to the field of semiconductor technology, in particular to a chip packaging machine. The chip packaging machine comprises a frame assembly as well as a chip feeding device, a chip positioning device, a handling manipulator device and an automatic packaging device which are arranged on the frame assembly, wherein the chip feeding device is used for realizing the feeding function of a chip to be packaged; the chip positioning device is connected with the chip feeding device; the chip positioning device is used for positioning the chip to be packaged; the handling manipulator device is used for handling a chip workpiece among the chip feeding device, the chip positioning device and the automatic packaging device; the automatic packaging device is connected with the chippositioning device; and the automatic packaging device is applied to feeding of a material cup, feeding of a heat sealing film and heat sealing of the heat sealing film and the material cup. The chippackaging machine has the advantages of fully and automatically finishing feeding of semiconductor devices, material cups and heat sealing films and finishing packaging of the semiconductor devices along with high processing efficiency.

Description

technical field [0001] The invention relates to the technical field of chips, in particular to chip production equipment. Background technique [0002] After the chip production and testing are completed, the chip must be put into the insulating cup and then sealed with a heat-sealing film. The existing packaging method is as follows: through the movement of the manipulator, the chips are placed one by one into the filling chamber of the insulating cup with a fixed position. , Move the insulating cup to the bottom of the hot-pressed film equipment, and the hot-pressed film will seal the material chamber to complete the packaging of the chip. The disadvantage of existing chip packaging equipment is low processing efficiency. Contents of the invention [0003] The purpose of the present invention is to provide a fully automatic chip packaging machine with high processing efficiency. [0004] In order to achieve the above object, the technical solution adopted by the prese...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/677H01L21/68
CPCH01L21/67126H01L21/677H01L21/68
Inventor 王加骇
Owner 王加骇