Unlock instant, AI-driven research and patent intelligence for your innovation.

PCB production procedures for reducing dry film hole breaking

A production process and PCB board technology, applied in the direction of removing conductive materials by chemical/electrolytic methods, etc., can solve the problems of affecting the electrical performance of PCBA, limited ability to seal holes, and difficult production of outer dry film, so as to reduce product scrap. The effect of reducing dry film breakage and improving market competitiveness

Active Publication Date: 2018-10-12
广东喜珍电路科技有限公司
View PDF5 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are round holes and slots with large apertures in many PCB designs, but this brings a problem to the production of outer dry film in the PCB industry
Due to the dry film production process of PCB, the thickness of the dry film is thin, it has fluidity itself, and the ability to seal holes is limited. If the dry film is not perforated in the positive film process, there will be residual copper in the NPTH hole. If the dry film is not perforated in the negative process, it will directly lead to PTH. There is no copper in the hole, which affects the electrical performance of PCBA and has a major quality risk

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • PCB production procedures for reducing dry film hole breaking

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] A PCB production process for reducing dry film holes, specifically including the following steps:

[0030] (1) Copper-plated PCB boards are assembled in such a way that the long sides of the slots on the board (the slot diameter is 2mm*4mm) are parallel (such as figure 1 shown), and then grind and sharpen the slot holes and round holes on the PCB board; apply the film on the board, the direction of the board is perpendicular to the long side of the slot hole on the PCB board, and the temperature of the board is controlled at 50 ℃, the temperature of the film is 105 ℃, the pressure of the film is 3.8 kg / cm², the speed of the film is 2.0m / min, and the time of the veneer film is 0.5s;

[0031] (2) After the film is pasted, let it stand for 60 minutes, expose according to the exposure energy of the 6-grid exposure ruler, and then use 1.2wt% sodium carbonate aqueous solution to develop. The developing temperature is 32°C, the developing point is 55%, and the developing spray...

Embodiment 2

[0033] A PCB production process for reducing dry film holes, specifically including the following steps:

[0034] (1) The copper-plated PCB board is made up in such a way that the long sides of the slots on the board (the slot diameter is 2mm*5mm) are all parallel (see figure 1 shown), and then grind and sharpen the slot holes and round holes on the PCB board; apply film on the board, the direction of the board feeding is perpendicular to the long side of the slot hole on the PCB board, and the temperature of the board feeding is controlled at 45 ℃, the temperature of the film is 115°C, the pressure of the film is 4.0 kg / cm², the speed of the film is 2.5m / min, and the time of the veneer film is 1.5s;

[0035] (2) After the film is pasted, let it stand for 40 minutes, expose according to the exposure energy of 6.5 grid exposure scales, and then use 0.8wt% sodium carbonate aqueous solution to develop. The developing temperature is 28°C, the developing point is 50%, and the devel...

Embodiment 3

[0037] A PCB production process for reducing dry film holes, specifically including the following steps:

[0038] (1) Copper-plated PCB boards are assembled in such a way that the long sides of the slots on the board (the slot diameter is 3mm*6mm) are parallel (see figure 1 Shown), and then grind and sharpen the slot holes and round holes on the PCB; apply film on the board, the direction of the board is perpendicular to the long side of the slot on the PCB, and the temperature of the board is controlled at 55 ℃, the temperature of the film is 110 ℃, the pressure of the film is 4.1 kg / cm², the speed of the film is 3.2m / min, and the time of the veneer film is 1.0s;

[0039] (2) After the film is pasted, let it stand for 15 minutes, expose according to the exposure energy of the 7-grid exposure scale, and then use 1.0wt% sodium carbonate aqueous solution to develop. The developing temperature is 30°C, the developing point is 60%, and the developing spray pressure 1.0 kg / cm 2 ,...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses PCB production procedures for reducing dry film hole breaking. The procedures comprise the steps that (1), copper plating PCB boards are assembled according to a manner in which long sides of holes formed in the PCB boards are parallel, the PCB boards are fed, and film sticking is conducted; (2), the PCB boards are placed statically after film sticking is completed, and PCBboards with patterns are obtained after exposure, developing, etching, demolding, washing and drying are conducted. According to the procedures, hole breaking of dry films is effectively reduced by designing film sticking assembling patterns of the PCB boards and controlling processes of the exposure, developing, etching and the like, product rejection rate is reduced, production cost is reduced,PCB production efficiency is improved, and therefore market competitiveness is improved.

Description

technical field [0001] The invention relates to the technical field of PCB production, in particular to a PCB production process for reducing dry film holes. Background technique [0002] With the multifunctional development of electronic products, printed circuit boards (PCBs) are widely used in communication equipment, aerospace, automobiles, network energy and other fields. There are round holes and slots with large apertures in many PCB designs, but this brings a problem to the production of outer dry film in the PCB industry. Due to the dry film production process of PCB, the thickness of the dry film is thin, it has fluidity itself, and the ability to seal holes is limited. If the dry film is not perforated in the positive film process, there will be residual copper in the NPTH hole. If the dry film is not perforated in the negative process, it will directly lead to PTH. There is no copper in the hole, which affects the electrical performance of PCBA and has a major q...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/06
CPCH05K3/06
Inventor 张先鹏贺波蒋善刚文国堂
Owner 广东喜珍电路科技有限公司